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Manufacturer Part Number: 70t3589s166bc
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70T3589S166BC8
 Integrated Device Technology Inc 		$71.9712 No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3589S166BC
 Integrated Device Technology Inc 		$90.8033 No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 BC256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3589S166BCI
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BCGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BCI
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BCG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e1 3 70 °C 260 30 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BCI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 85 °C -40 °C 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BC8
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BCGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 2.3593 Mbit 36 64KX36 12 ns 166 MHz MULTI-PORT SRAM COMMON 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 510 µA CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e1 3 85 °C -40 °C 260 30 256 PLASTIC/EPOXY BGA BGA256,16X16,40 SQUARE GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC compliant 3A991.B.2.A 8542.32.00.41
IDT70T3589S166BC
 Integrated Device Technology Inc 		Check for Price No No Transferred 2.3593 Mbit 36 64KX36 2.5 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 3 70 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
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