Parametric results for: 70T3539MS133BCI under SRAMs

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Manufacturer Part Number: 70t3539ms133bci
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IDT70T3539MS133BCI8
Integrated Device Technology Inc
Check for Price No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3539MS133BCI8
Renesas Electronics Corporation
Check for Price No No Obsolete 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 not_compliant NLR 8542320041 BC256 Renesas Electronics
70T3539MS133BCI
Renesas Electronics Corporation
Check for Price No No Active 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm RENESAS ELECTRONICS CORP CABGA 256 not_compliant NLR 8542320041 BC256 Renesas Electronics
IDT70T3539MS133BCI
Integrated Device Technology Inc
Check for Price No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn63Pb37) BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LBGA, BGA256,16X16,40 256 not_compliant 3A991.B.2.A 8542.32.00.41
70T3539MS133BCI
Integrated Device Technology Inc
Check for Price No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.7 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 256 not_compliant 3A991.B.2.A 8542.32.00.41 BC256
70T3539MS133BCI8
Integrated Device Technology Inc
Check for Price No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 25 mA 2.4 V 900 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B256 Not Qualified e0 3 85 °C -40 °C 225 20 256 PLASTIC/EPOXY LBGA BGA256,16X16,40 SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.5 mm 17 mm 17 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA BGA-256 256 not_compliant 3A991.B.2.A 8542.32.00.41 BC256