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Manufacturer Part Number: 70t3519s133bfgi
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IDT70T3519S133BFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
IDT70T3519S133BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 15 ns 133 MHz MULTI-PORT SRAM COMMON 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 2.4 V 450 µA CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC FBGA, BGA208,17X17,32 compliant 3A991.B.2.A 8542.32.00.41
70T3519S133BFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 208 compliant 3A991.B.2.A 8542.32.00.41 BFG208
70T3519S133BFGI
 Renesas Electronics Corporation 		Check for Price Yes Yes Active 9.4372 Mbit 36 256KX36 2.5 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 compliant NLR 8542320041 BFG208 Renesas Electronics
70T3519S133BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 2.5 V 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC CABGA FPBGA-208 208 compliant 3A991.B.2.A 8542.32.00.41 BFG208
70T3519S133BFGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 9.4372 Mbit 36 256KX36 2.5 V 4.2 ns 133 MHz MULTI-PORT SRAM COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY BGA BGA208,17X17,32 SQUARE GRID ARRAY YES TIN SILVER COPPER BALL 800 µm BOTTOM RENESAS ELECTRONICS CORP CABGA 208 compliant NLR 8542320041 BFG208 Renesas Electronics