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IDT7052L35GM
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | APPLICATION SPECIFIC SRAM | COMMON | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 mA | 2 V | 300 µA | CMOS | MILITARY | S-XPGA-P108 | Not Qualified | e0 | 125 °C | -55 °C | 108 | CERAMIC | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||||||||
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7052L35GB
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN; BATTERY BACKUP | COMMON | 1 | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 mA | 2 V | 360 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P108 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-PRF-38535 Class Q | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 3A001.A.2.C | 8542.32.00.41 | PGA | 1.210 X 1.210 INCH, 0.160 INCH HEIGHT, PGA-108 | 108 | GU108 | 1989-07-24 | ||||
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7052L35G
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN; BATTERY BACKUP | COMMON | 1 | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 600 µA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P108 | Not Qualified | e0 | 1 | 70 °C | 240 | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | PGA | 1.210 X 1.210 INCH, 0.160 INCH HEIGHT, PGA-108 | 108 | GU108 | 1989-07-24 | ||||||
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IDT7052L35GGB
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | MULTI-PORT SRAM | AUTOMATIC POWER-DOWN; BATTERY BACKUP | 1 | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 2 V | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P108 | Not Qualified | e3 | 125 °C | -55 °C | MIL-PRF-38535 Class Q | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 3A001.A.2.C | 8542.32.00.41 | PGA | PGA, | 108 | |||||||||||
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7052L35GG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | MULTI-PORT SRAM | COMMON | 1 | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 600 µA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P108 | Not Qualified | e3 | 70 °C | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | PGA | PGA, PGA108,12X12 | 108 | |||||||||||
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IDT7052L35GGM
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | APPLICATION SPECIFIC SRAM | COMMON | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 mA | 2 V | 300 µA | CMOS | MILITARY | S-XPGA-P108 | Not Qualified | e3 | 125 °C | -55 °C | 108 | CERAMIC | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||||||||
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7052L35GGB
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | MULTI-PORT SRAM | COMMON | 1 | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 mA | 2 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P108 | Not Qualified | e3 | 125 °C | -55 °C | MIL-PRF-38535 Class Q | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 3A001.A.2.C | 8542.32.00.41 | PGA | PGA, PGA108,12X12 | 108 | |||||||||
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7052L35GM
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | APPLICATION SPECIFIC SRAM | COMMON | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 mA | 2 V | 300 µA | CMOS | MILITARY | S-XPGA-P108 | Not Qualified | e0 | 125 °C | -55 °C | 108 | CERAMIC | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||||||||
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7052L35G
Renesas Electronics Corporation
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Check for Price | No | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | FOUR-PORT SRAM | AUTOMATIC POWER-DOWN; BATTERY BACKUP | COMMON | 1 | 4 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 600 µA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P108 | Not Qualified | e0 | 1 | 70 °C | 240 | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA108,12X12 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | RENESAS ELECTRONICS CORP | compliant | NLR | 8542320041 | PGA | 1.210 X 1.210 INCH, 0.160 INCH HEIGHT, PGA-108 | 108 | GU108 | Renesas Electronics | ||||||
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7052L35GGB8
Integrated Device Technology Inc
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Check for Price | Transferred | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | MULTI-PORT SRAM | 1 | 2000 | 2.048 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P108 | 125 °C | -55 °C | MIL-PRF-38535 Class Q | 108 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 30.48 mm | 30.48 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | 3A001.A.2.C | 8542.32.00.41 | PGA, |