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7006L55GGB
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e3 | 125 °C | -55 °C | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA68,11X11 | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | 2.413 mm | 27.889 mm | 27.889 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | PGA, PGA68,11X11 | 68 | compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||
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7006L55GG8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | e3 | 70 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | Matte Tin (Sn) | PIN/PEG | 2.54 mm | PERPENDICULAR | 2.413 mm | 27.889 mm | 27.889 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA, | compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||||||||
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IDT7006L55GI
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-CPGA-P68 | Not Qualified | e0 | 85 °C | -40 °C | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | SPGA, PGA68,11X11 | 68 | not_compliant | EAR99 | 8542.32.00.41 | ||||||||||
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7006L55G
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 285 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | compliant | EAR99 | 8542.32.00.41 | GU68 | 1989-07-24 | ||||||
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7006L55G
Renesas Electronics Corporation
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Check for Price | No | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 285 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | RENESAS ELECTRONICS CORP | PGA | 68 | compliant | NLR | 8542320041 | GU68 | Renesas Electronics | |||||||
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7006L55GGI8
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-CPGA-P68 | 85 °C | -40 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | PIN/PEG | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | PGA-68 | compliant | EAR99 | 8542.32.00.41 | |||||||||||||||||||||||||||
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7006L55GB
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | compliant | 3A001.A.2.C | 8542.32.00.41 | GU68 | 1989-07-24 | ||||
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IDT7006L55G
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 1.5 mA | 2 V | 285 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 70 °C | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | SPGA, PGA68,11X11 | 68 | not_compliant | EAR99 | 8542.32.00.41 | 1989-07-24 | ||||||||
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7006L55GGB8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e3 | 125 °C | -55 °C | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | Matte Tin (Sn) | PIN/PEG | 2.54 mm | PERPENDICULAR | 2.413 mm | 27.889 mm | 27.889 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA, | compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||||||||
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7006L55GGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-CPGA-P68 | Not Qualified | e3 | 85 °C | -40 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | 2.413 mm | 27.889 mm | 27.889 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | PGA, | 68 | compliant | EAR99 | 8542.32.00.41 |