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7006S25G
Integrated Device Technology Inc
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$56.3122 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 25 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 360 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | EAR99 | 8542.32.00.41 | 1992-01-01 | ||||
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7006S17G
Integrated Device Technology Inc
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$64.6389 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 17 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 310 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | EAR99 | 8542.32.00.41 | 1992-01-01 | ||||
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7006S20G
Integrated Device Technology Inc
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$64.6389 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 20 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 290 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | EAR99 | 8542.32.00.41 | 1992-01-01 | ||||
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7006S55G
Integrated Device Technology Inc
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$64.6389 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 335 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | EAR99 | 8542.32.00.41 | 1989-07-24 | ||||
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7006S35G
Integrated Device Technology Inc
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$64.6389 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 35 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 340 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 1 | 70 °C | 240 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | PGA-68 | 68 | GU68 | compliant | EAR99 | 8542.32.00.41 | 1989-07-24 | ||||
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7006S70GB
Integrated Device Technology Inc
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$219.6938 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 70 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | PGA-68 | 68 | GU68 | compliant | 3A001.A.2.C | 8542.32.00.41 | 1989-07-24 | ||
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7006S55GB
Integrated Device Technology Inc
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$241.5943 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | 3A001.A.2.C | 8542.32.00.41 | 1989-07-24 | ||
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7006S35GB
Integrated Device Technology Inc
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$306.5319 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 35 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | 3A001.A.2.C | 8542.32.00.41 | 1992-01-01 | ||
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7006S25GB
Integrated Device Technology Inc
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$342.6152 | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 25 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 340 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-CPGA-P68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 68 | CERAMIC, METAL-SEALED COFIRED | SPGA | PGA68,11X11 | SQUARE | GRID ARRAY, SHRINK PITCH | NO | TIN LEAD | PIN/PEG | 1.27 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | PGA | 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, CERAMIC, PGA-68 | 68 | GU68 | compliant | 3A001.A.2.C | 8542.32.00.41 | 1992-01-01 | ||
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IDT7006S35JI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 131.072 kbit | 8 | 16KX8 | 5 V | 35 ns | MULTI-PORT SRAM | 1 | 16000 | 16.384 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQCC-J68 | Not Qualified | e0 | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 | 68 | compliant | EAR99 | 8542.32.00.41 |