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IDT7006L55JB
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQCC-J68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 225 | MIL-PRF-38535 | 20 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | QCCJ, LDCC68,1.0SQ | 68 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | ||
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7006L55JB
Integrated Device Technology Inc
|
Check for Price | No | No | Transferred | 131.072 kbit | 8 | 16KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 4 mA | 2 V | 250 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQCC-J68 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 225 | MIL-PRF-38535 | 20 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | QCCJ, LDCC68,1.0SQ | 68 | not_compliant | 3A001.A.2.C | 8542.32.00.41 |