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7005S55PFGB
Integrated Device Technology Inc
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IDT7005S55PF
Integrated Device Technology Inc
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IDT7005S55PF9
Integrated Device Technology Inc
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7005S55PF
Integrated Device Technology Inc
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7005S55PFB
Integrated Device Technology Inc
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7005S55PFG8
Integrated Device Technology Inc
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7005S55PFG
Integrated Device Technology Inc
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IDT7005S55PFG
Integrated Device Technology Inc
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IDT7005S55PFGB
Integrated Device Technology Inc
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IDT7005S55PF8
Integrated Device Technology Inc
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Memory IC Type
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Additional Feature
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I/O Type
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Number of Functions | Number of Ports | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Output Enable
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Parallel/Serial
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Standby Current-Max
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Standby Voltage-Min
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Manufacturer Package Code
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Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQFP-G64 | Not Qualified | e3 | 3 | 125 °C | -55 °C | 260 | 30 | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP | QFP, QFP64,.66SQ,32 | 64 | compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||||
No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 | ||||
No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.41 | |||||||||
No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 | PN64 | ||||
No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | APPLICATION SPECIFIC SRAM | COMMON | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | CMOS | MILITARY | S-PQFP-G64 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 240 | 38535Q/M;38534H;883B | 30 | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP, QFP64,.66SQ,32 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||||||||
Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | DUAL-PORT SRAM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP, | compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||||||||||
Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP | QFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.41 | |||||||||
Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.41 | ||||||
Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQFP-G64 | Not Qualified | e3 | 3 | 125 °C | -55 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | 3A001.A.2.C | 8542.32.00.41 | |||||
No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 |
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7005S55PFGB
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQFP-G64 | Not Qualified | e3 | 3 | 125 °C | -55 °C | 260 | 30 | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP | QFP, QFP64,.66SQ,32 | 64 | compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||
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IDT7005S55PF
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 | |||||
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IDT7005S55PF9
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | compliant | EAR99 | 8542.32.00.41 | ||||||||||
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7005S55PF
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 | PN64 | |||||
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7005S55PFB
Integrated Device Technology Inc
|
Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | APPLICATION SPECIFIC SRAM | COMMON | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | CMOS | MILITARY | S-PQFP-G64 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 240 | 38535Q/M;38534H;883B | 30 | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP, QFP64,.66SQ,32 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||
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7005S55PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | DUAL-PORT SRAM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP, | compliant | EAR99 | 8542.32.00.41 | |||||||||||||||||||||||||
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7005S55PFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | QFP | QFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.41 | ||||||||||
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IDT7005S55PFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | EAR99 | 8542.32.00.41 | |||||||
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IDT7005S55PFGB
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQFP-G64 | Not Qualified | e3 | 3 | 125 °C | -55 °C | 260 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP64,.66SQ,32 | 64 | compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||
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IDT7005S55PF8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | MULTI-PORT SRAM | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | COMMON | 1 | 2 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 250 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 |