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5962-8866905ZA
Teledyne e2v
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Check for Price | No | Active | 18.432 kbit | 9 | 2KX9 | 5 V | 30 ns | 25 MHz | 40 ns | OTHER FIFO | RETRANSMIT | 1 | 2000 | 2.048 k | ASYNCHRONOUS | NO | PARALLEL | 25 mA | 150 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.286 mm | 13.97 mm | 11.43 mm | TELEDYNE E2V (UK) LTD | not_compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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5962-8866905ZA
Defense Logistics Agency
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Check for Price | Active | 18.432 kbit | 9 | 2KX9 | 5 V | 30 ns | 40 ns | OTHER FIFO | RETRANSMIT | 1 | 2000 | 2.048 k | ASYNCHRONOUS | NO | PARALLEL | 150 µA | 5.5 V | 4.5 V | CMOS | MILITARY | Qualified | e0 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.286 mm | 13.97 mm | 11.43 mm | DEFENSE LOGISTICS AGENCY | unknown | CERAMIC, LLCC-32 | |||||||||||||||||||||
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5962-8866905ZA
Renesas Electronics Corporation
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Check for Price | No | No | Obsolete | 18.432 kbit | 9 | 2KX9 | 5 V | 30 ns | 25 MHz | 40 ns | OTHER FIFO | RETRANSMIT | 1 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 25 mA | 150 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Qualified | e0 | 1 | 125 °C | -55 °C | 240 | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | RENESAS ELECTRONICS CORP | not_compliant | NLR | 8542320071 | LCC-32 | LCC | 32 | LC32 | Renesas Electronics | |||
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5962-8866905ZA
Cypress Semiconductor
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Check for Price | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 25 ns | 35 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 2.048 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 120 µA | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.286 mm | 13.97 mm | 11.43 mm | CYPRESS SEMICONDUCTOR CORP | unknown | EAR99 | 8542.32.00.71 | CERAMIC, LLCC-32 | QFJ | 32 | |||||||||||||||
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5962-8866905ZA
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 18.432 kbit | 9 | 2KX9 | 5 V | 30 ns | 25 MHz | 40 ns | OTHER FIFO | RETRANSMIT | 1 | 2000 | 2.048 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 25 mA | 150 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 240 | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.71 | LCC-32 | LCC | 32 | LC32 | 1992-01-01 | |||
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5962-8866905ZA
QP Semiconductor
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Check for Price | Transferred | 18.432 kbit | 9 | 2KX9 | 5 V | 30 ns | 40 ns | RETRANSMIT | 1 | 2000 | 2.048 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.286 mm | 13.97 mm | 11.43 mm | QP SEMICONDUCTOR INC | unknown | EAR99 | 8542.32.00.71 |