Findchips: Parametric Search Results for 5962-9158506MYA


Select Parts		Part Number

		5962-9158506MYA Integrated Device Technology Inc
		5962-9158506MYA Cypress Semiconductor
		5962-9158506MYA QP Semiconductor
		5962-9158506MYA Teledyne e2v

		Most Relevant						Technical															Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Cycle Time	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

9.216 kbit

1KX9

5 V

30 ns

40 ns

OTHER FIFO

RETRANSMIT

1000

1.024 k

ASYNCHRONOUS

PARALLEL

140 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

4.608 kbit

512X9

5 V

25 ns

35 ns

OTHER FIFO

RETRANSMIT

512

1.024 k

ASYNCHRONOUS

3-STATE

PARALLEL

80 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

CYPRESS SEMICONDUCTOR CORP

DIP

DIP,

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

9.216 kbit

1KX9

5 V

30 ns

40 ns

RETRANSMIT

1000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

QP SEMICONDUCTOR INC

DIP,

unknown

EAR99

8542.32.00.71

Check for Price

Active

9.216 kbit

1KX9

5 V

30 ns

40 ns

OTHER FIFO

RETRANSMIT

1000

1.024 k

ASYNCHRONOUS

PARALLEL

25 mA

140 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

TELEDYNE E2V (UK) LTD

DIP, DIP28,.6

compliant

EAR99

8542.32.00.71

Compare

5962-9158506MYA

Integrated Device Technology Inc

Check for Price

Obsolete

9.216 kbit

1KX9

5 V

30 ns

40 ns

OTHER FIFO

RETRANSMIT

1000

1.024 k

ASYNCHRONOUS

PARALLEL

140 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

unknown

EAR99

8542.32.00.71

5962-9158506MYA

Cypress Semiconductor

Check for Price

Obsolete

4.608 kbit

512X9

5 V

25 ns

35 ns

OTHER FIFO

RETRANSMIT

512

1.024 k

ASYNCHRONOUS

3-STATE

PARALLEL

80 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

CYPRESS SEMICONDUCTOR CORP

DIP

DIP,

unknown

EAR99

8542.32.00.71

5962-9158506MYA

QP Semiconductor

Check for Price

Transferred

9.216 kbit

1KX9

5 V

30 ns

40 ns

RETRANSMIT

1000

1.024 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

QP SEMICONDUCTOR INC

DIP,

unknown

EAR99

8542.32.00.71

5962-9158506MYA

Teledyne e2v

Check for Price

Active

9.216 kbit

1KX9

5 V

30 ns

40 ns

OTHER FIFO

RETRANSMIT

1000

1.024 k

ASYNCHRONOUS

PARALLEL

25 mA

140 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

37.338 mm

15.24 mm

TELEDYNE E2V (UK) LTD

DIP, DIP28,.6

compliant

EAR99

8542.32.00.71

Parametric results for: 5962-9158506MYA under FIFOs