Findchips: Parametric Search Results for 5962-8863403zx


Select Parts		Part Number

		5962-8863403ZX Atmel Corporation
		5962-8863403ZX Microchip Technology Inc
		5962-8863403ZX LSI Corporation
		5962-8863403ZX Xicor Inc
		5962-8863403ZX Teledyne e2v

				Most Relevant					Technical													Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

262.144 kbit

32KX8

5 V

90 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.3 mm

10.16 mm

ATMEL CORP

DFP

DFP,

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

MICROCHIP TECHNOLOGY INC

FP-28

compliant

3A001.A.2.C

8542.32.00.51

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Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.3 mm

SEEQ TECHNOLOGY INC

DFP,

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.3 mm

XICOR INC

CERAMIC, FP-28

unknown

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.3 mm

10.16 mm

E2V TECHNOLOGIES PLC

DFP

DFP,

unknown

3A001.A.2.C

8542.32.00.51

Compare

5962-8863403ZX

Atmel Corporation

Check for Price

Transferred

262.144 kbit

32KX8

5 V

90 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.3 mm

10.16 mm

ATMEL CORP

DFP

DFP,

compliant

3A001.A.2.C

8542.32.00.51

5962-8863403ZX

Microchip Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

MICROCHIP TECHNOLOGY INC

FP-28

compliant

3A001.A.2.C

8542.32.00.51

5962-8863403ZX

LSI Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.3 mm

SEEQ TECHNOLOGY INC

DFP,

unknown

3A001.A.2.C

8542.32.00.51

5962-8863403ZX

Xicor Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

R-CDFP-F28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.3 mm

XICOR INC

CERAMIC, FP-28

unknown

5962-8863403ZX

Teledyne e2v

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

90 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.3 mm

10.16 mm

E2V TECHNOLOGIES PLC

DFP

DFP,

unknown

3A001.A.2.C

8542.32.00.51

Parametric results for: 5962-8863403zx under EEPROMs