Findchips: Parametric Search Results for 5962-8852515ZX


Select Parts		Part Number

		5962-8852515ZX Microchip Technology Inc
		5962-8852515ZX LSI Corporation
		5962-8852515ZX Atmel Corporation
		5962-8852515ZX Teledyne e2v

				Most Relevant					Technical														Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

MICROCHIP TECHNOLOGY INC

FP-28

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

80 µA

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

MIL-STD-883

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

SEEQ TECHNOLOGY INC

DFP,

unknown

3A001.A.2.C

8542.32.00.51

DFP

Check for Price

Transferred

262.144 kbit

32KX8

5 V

150 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

ATMEL CORP

DFP,

compliant

3A001.A.2.C

8542.32.00.51

DFP

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

50 µA

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

E2V TECHNOLOGIES PLC

QFF,

unknown

3A001.A.2.C

8542.32.00.51

DFP

Compare

5962-8852515ZX

Microchip Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

MICROCHIP TECHNOLOGY INC

FP-28

compliant

3A001.A.2.C

8542.32.00.51

5962-8852515ZX

LSI Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

80 µA

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

NOT SPECIFIED

MIL-STD-883

NOT SPECIFIED

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

SEEQ TECHNOLOGY INC

DFP,

unknown

3A001.A.2.C

8542.32.00.51

DFP

5962-8852515ZX

Atmel Corporation

Check for Price

Transferred

262.144 kbit

32KX8

5 V

150 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

ATMEL CORP

DFP,

compliant

3A001.A.2.C

8542.32.00.51

DFP

5962-8852515ZX

Teledyne e2v

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

150 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

50 µA

5.5 V

4.5 V

CMOS

MILITARY

3 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

E2V TECHNOLOGIES PLC

QFF,

unknown

3A001.A.2.C

8542.32.00.51

DFP

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Parametric results for: 5962-8852515ZX under EEPROMs