Findchips: Parametric Search Results for 5962-8852509YX


Select Parts		Part Number

		5962-8852509YX LSI Corporation
		5962-8852509YX Atmel Corporation
		5962-8852509YX Xicor Inc
		5962-8852509YX Teledyne e2v

				Most Relevant					Technical																				Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

80 µA

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

NO LEAD

QUAD

SEEQ TECHNOLOGY INC

QFJ

QCCN,

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

50 µA

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

13.97 mm

11.43 mm

ATMEL CORP

QFJ

HQCCN,

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

YES

10000 Write/Erase Cycles

32000

32.768 k

ASYNCHRONOUS

64 words

PARALLEL

5 V

350 µA

80 µA

5.5 V

4.5 V

CMOS

MILITARY

YES

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

NO LEAD

1.27 mm

QUAD

XICOR INC

CERAMIC, LCC-32

unknown

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

50 µA

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

13.97 mm

11.43 mm

E2V TECHNOLOGIES PLC

QFJ

HQCCN,

unknown

3A001.A.2.C

8542.32.00.51

Compare

5962-8852509YX

LSI Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

80 µA

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

QCCN

RECTANGULAR

CHIP CARRIER

YES

NO LEAD

QUAD

SEEQ TECHNOLOGY INC

QFJ

QCCN,

unknown

3A001.A.2.C

8542.32.00.51

5962-8852509YX

Atmel Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

50 µA

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

13.97 mm

11.43 mm

ATMEL CORP

QFJ

HQCCN,

compliant

3A001.A.2.C

8542.32.00.51

5962-8852509YX

Xicor Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

YES

10000 Write/Erase Cycles

32000

32.768 k

ASYNCHRONOUS

64 words

PARALLEL

5 V

350 µA

80 µA

5.5 V

4.5 V

CMOS

MILITARY

YES

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

QCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER

YES

NO LEAD

1.27 mm

QUAD

XICOR INC

CERAMIC, LCC-32

unknown

5962-8852509YX

Teledyne e2v

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

350 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

50 µA

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CQCC-N32

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

YES

TIN LEAD

NO LEAD

1.27 mm

QUAD

2.54 mm

13.97 mm

11.43 mm

E2V TECHNOLOGIES PLC

QFJ

HQCCN,

unknown

3A001.A.2.C

8542.32.00.51

Parametric results for: 5962-8852509YX under EEPROMs