Findchips: Parametric Search Results for 5962-8852504ZX


Select Parts		Part Number

		5962-8852504ZX Microchip Technology Inc
		5962-8852504ZX LSI Corporation
		5962-8852504ZX Atmel Corporation
		5962-8852504ZX Teledyne e2v
		5962-8852504ZX Xicor Inc

				Most Relevant					Technical													Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

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Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

MICROCHIP TECHNOLOGY INC

FP-28

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

SEEQ TECHNOLOGY INC

DFP,

unknown

3A001.A.2.C

8542.32.00.51

DFP

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Transferred

262.144 kbit

32KX8

5 V

200 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

ATMEL CORP

DFP,

compliant

3A001.A.2.C

8542.32.00.51

DFP

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

QFF

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

TELEDYNE E2V (UK) LTD

QFF,

unknown

3A001.A.2.C

8542.32.00.51

DFP

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

XICOR INC

DFP,

unknown

Compare

5962-8852504ZX

Microchip Technology Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

MICROCHIP TECHNOLOGY INC

FP-28

compliant

3A001.A.2.C

8542.32.00.51

5962-8852504ZX

LSI Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

SEEQ TECHNOLOGY INC

DFP,

unknown

3A001.A.2.C

8542.32.00.51

DFP

5962-8852504ZX

Atmel Corporation

Check for Price

Transferred

262.144 kbit

32KX8

5 V

200 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class C

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

ATMEL CORP

DFP,

compliant

3A001.A.2.C

8542.32.00.51

DFP

5962-8852504ZX

Teledyne e2v

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

AUTOMATIC WRITE

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

QFF

RECTANGULAR

FLATPACK

YES

TIN LEAD

FLAT

1.27 mm

DUAL

3.02 mm

18.285 mm

10.16 mm

TELEDYNE E2V (UK) LTD

QFF,

unknown

3A001.A.2.C

8542.32.00.51

DFP

5962-8852504ZX

Xicor Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

200 ns

EEPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5 V

5.5 V

4.5 V

CMOS

MILITARY

10 ms

R-CDFP-F28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, METAL-SEALED COFIRED

DFP

RECTANGULAR

FLATPACK

YES

FLAT

DUAL

XICOR INC

DFP,

unknown

Parametric results for: 5962-8852504ZX under EEPROMs