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Parametric » Memory » EPROMs

Parametric results for: 5962-8751508KA under EPROMs

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Select Parts		Part Number

		5962-8751508KA Teledyne e2v
		5962-8751508KA QP Semiconductor
		5962-8751508KA Cypress Semiconductor

		Most Relevant					Technical													Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Package Description	Part Package Code	Pin Count

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Active

65.536 kbit

8

8KX8

5 V

35 ns

UVPROM

COMMON

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F24

Qualified

e0

125 °C

-55 °C

38535Q/M;38534H;883B

24

CERAMIC, GLASS-SEALED

WDFP

FL24,.4

RECTANGULAR

FLATPACK, WINDOW

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.54 mm

15.367 mm

9.652 mm

TELEDYNE E2V (UK) LTD

compliant

3A001.A.2.C

8542.32.00.61

Check for Price

Transferred

65.536 kbit

8

8KX8

5 V

35 ns

UVPROM

1

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F24

Not Qualified

e0

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

WDFP

RECTANGULAR

FLATPACK, WINDOW

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.54 mm

15.367 mm

9.652 mm

QP SEMICONDUCTOR INC

unknown

3A001.A.2.C

8542.32.00.61

WDFP,

Check for Price

Obsolete

65.536 kbit

8

8KX8

5 V

35 ns

UVPROM

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F24

Not Qualified

e0

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

WDFP

RECTANGULAR

FLATPACK, WINDOW

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.54 mm

15.367 mm

9.652 mm

CYPRESS SEMICONDUCTOR CORP

unknown

3A001.A.2.C

8542.32.00.61

WDFP,

DFP

24

Compare

Teledyne e2v

Check for Price

Active

65.536 kbit

8

8KX8

5 V

35 ns

UVPROM

COMMON

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

120 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F24

Qualified

e0

125 °C

-55 °C

38535Q/M;38534H;883B

24

CERAMIC, GLASS-SEALED

WDFP

FL24,.4

RECTANGULAR

FLATPACK, WINDOW

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.54 mm

15.367 mm

9.652 mm

TELEDYNE E2V (UK) LTD

compliant

3A001.A.2.C

8542.32.00.61

QP Semiconductor

Check for Price

Transferred

65.536 kbit

8

8KX8

5 V

35 ns

UVPROM

1

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F24

Not Qualified

e0

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

WDFP

RECTANGULAR

FLATPACK, WINDOW

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.54 mm

15.367 mm

9.652 mm

QP SEMICONDUCTOR INC

unknown

3A001.A.2.C

8542.32.00.61

WDFP,

Cypress Semiconductor

Check for Price

Obsolete

65.536 kbit

8

8KX8

5 V

35 ns

UVPROM

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDFP-F24

Not Qualified

e0

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

WDFP

RECTANGULAR

FLATPACK, WINDOW

YES

TIN LEAD

FLAT

1.27 mm

DUAL

2.54 mm

15.367 mm

9.652 mm

CYPRESS SEMICONDUCTOR CORP

unknown

3A001.A.2.C

8542.32.00.61

WDFP,

DFP

24