Findchips: Parametric Search Results for 5962-8606310XA


Select Parts		Part Number

		5962-8606310XA STMicroelectronics
		5962-8606310XA Waferscale Integration Inc
		5962-8606310XA Teledyne e2v
		5962-8606310XA AMD
		5962-8606310XA QP Semiconductor

			Most Relevant					Technical															Compliance			Operating Conditions			Physical											Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

262.144 kbit

32KX8

5 V

45 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

45 mA

130 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

STMICROELECTRONICS

DIP

CERAMIC, DIP-28

not_compliant

3A001.A.2.C

8542.32.00.61

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Obsolete

262.144 kbit

32KX8

5 V

45 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

DUAL

WAFERSCALE INTEGRATION INC

CERAMIC, DIP-28

unknown

3A001.A.2.C

8542.32.00.61

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Active

262.144 kbit

32KX8

5 V

45 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

45 mA

130 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

TELEDYNE E2V (UK) LTD

DIP

CERAMIC, DIP-28

compliant

3A001.A.2.C

8542.32.00.61

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Obsolete

262.144 kbit

32KX8

5 V

45 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

45 mA

130 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

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Transferred

262.144 kbit

32KX8

5 V

45 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

DUAL

QP SEMICONDUCTOR INC

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.61

Compare

5962-8606310XA

STMicroelectronics

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

45 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

45 mA

130 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

STMICROELECTRONICS

DIP

CERAMIC, DIP-28

not_compliant

3A001.A.2.C

8542.32.00.61

5962-8606310XA

Waferscale Integration Inc

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

45 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

100 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

DUAL

WAFERSCALE INTEGRATION INC

CERAMIC, DIP-28

unknown

3A001.A.2.C

8542.32.00.61

5962-8606310XA

Teledyne e2v

Check for Price

Active

262.144 kbit

32KX8

5 V

45 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

45 mA

130 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Qualified

125 °C

-55 °C

38535Q/M;38534H;883B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

TELEDYNE E2V (UK) LTD

DIP

CERAMIC, DIP-28

compliant

3A001.A.2.C

8542.32.00.61

5962-8606310XA

AMD

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Obsolete

262.144 kbit

32KX8

5 V

45 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

45 mA

130 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

5962-8606310XA

QP Semiconductor

Check for Price

Transferred

262.144 kbit

32KX8

5 V

45 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

DUAL

QP SEMICONDUCTOR INC

DIP

DIP,

unknown

3A001.A.2.C

8542.32.00.61

Parametric results for: 5962-8606310XA under EPROMs