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JAN2N3737UB
Microchip Technology Inc
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$19.0404 | No | Active | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | TO-46 | R-CDSO-N3 | e0 | Qualified | MIL-19500/395 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-3 | compliant | EAR99 | 8541.10.00.80 | ||||||||||||
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JANTX2N3737UB
Microchip Technology Inc
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$19.5318 | No | Active | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | TO-46 | R-CDSO-N3 | e0 | Qualified | MIL-19500/395 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-3 | compliant | EAR99 | 8541.10.00.80 | ||||||||||||
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2N3737UB
Microchip Technology Inc
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$20.1503 | No | Active | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | R-CDSO-N3 | Not Qualified | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-3 | compliant | EAR99 | |||||||||||||||||
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JANTXV2N3737UB
Microchip Technology Inc
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$26.9977 | No | Active | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | TO-46 | R-CDSO-N3 | e0 | Qualified | MIL-19500/395 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-3 | compliant | EAR99 | 8541.10.00.80 | ||||||||||||
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JANTXV2N3737UB
Defense Logistics Agency
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Check for Price | Active | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | TO-46 | R-XDSO-N3 | Qualified | MIL-19500/395G | UNSPECIFIED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | DEFENSE LOGISTICS AGENCY | SURFACE MOUNT PACKAGE-2 | unknown | EAR99 | |||||||||||||||||
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JANS2N3737UB
Microsemi Corporation
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Check for Price | No | No | Transferred | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | R-CDSO-N3 | e0 | Not Qualified | MIL-19500/395 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-3 | unknown | EAR99 | SOT | 3 | |||||||||||
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JANTXVF2N3737UB
Semicoa Semiconductors
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Check for Price | Contact Manufacturer | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SILICON | 48 ns | R-CDSO-N3 | MIL-19500; RH - 300K Rad(Si) | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | SEMICOA CORP | SMALL OUTLINE, R-CDSO-N3 | unknown | EAR99 | ||||||||||||||||||||
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JAN2N3737UB
Semicoa Semiconductors
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Check for Price | Yes | Contact Manufacturer | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | 500 mW | SILICON | 48 ns | R-CDSO-N3 | Qualified | MIL-19500/395 | 200 °C | NOT SPECIFIED | NOT SPECIFIED | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | SEMICOA CORP | HERMETIC SEALED, CERAMIC, CERSOT-3 | not_compliant | EAR99 | SOT | 3 | |||||||||||||
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2N3737UBJS
Semicoa Semiconductors
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Check for Price | Contact Manufacturer | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | 9 pF | 500 mW | 500 mW | SILICON | 48 ns | 900 mV | R-CDSO-N3 | MIL-PRF-19500; MIL-STD-750 | 200 °C | -65 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | SEMICOA CORP | , | unknown | EAR99 | 8541.21.00.95 | ||||||||||||||
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JAN2N3737UB
Microsemi Corporation
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Check for Price | No | No | Transferred | 40 V | 1.5 A | NPN | YES | SINGLE | 3 | 1 | 20 | SWITCHING | SILICON | 60 ns | 48 ns | TO-46 | R-CDSO-N3 | e0 | Not Qualified | MIL-19500/395 | 200 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-3 | unknown | EAR99 | TO-46 | 3 |