Parametric results for: 28C25625 under EEPROMs

All Filters Access Time-Max Additional Feature Command User Interface Data Polling Data Retention Time-Min Endurance JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Page Size Supply Voltage-Nom (Vsup) Access Time-Max (2)

200 ns 4 250 ns 109

Min (ns) - Max (ns)

119 hits Apply

10000 ERASE/PROGRAM CYCLES; DATA RETENTION > 10 YEARS 3 AUTOMATIC WRITE 55 AUTOMATIC WRITE;PAGE WRITE 17 HARDWARE & SOFTWARE DATA PROTECTION; DATA RETENTION = 10 YEARS 5 LG-MAX 2

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NO 65

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YES 65

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10 8

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10000.0 Write/Erase Cycles 65

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R-CDFP-F28 10 R-CDIP-T28 11 R-CPGA-P28 7 R-CQCC-N32 18 R-GDIP-T28 17 R-PDIP-T28 12 R-PDSO-G28 10 R-PQCC-J32 14 R-PZIP-T28 1 R-XDFP-F28 2 R-XDIP-T28 2 R-XPGA-P28 4 R-XQCC-N32 1 R-XUUC-N28 2 S-CDIP-T28 2 S-CQCC-N32 3 X-XUUC-N29 2

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e0 68 e3 11

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13.97 mm 22 16.5 mm 3 16.51 mm 4 17.9 mm 8 18.285 mm 5 18.3 mm 3 35.56 mm 3 36 mm 1 36.322 mm 2 36.7 mm 1 36.83 mm 2 37.0205 mm 4 37.1475 mm 2 37.215 mm 5 37.25 mm 4 37.846 mm 2

Min (mm) - Max (mm)

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Manufacturer (10)

AMD 4 Atmel Corporation 40 Exel Microelectronics Inc 3 Force Technologies Ltd 5 LAPIS Semiconductor Co Ltd 2 LSI Corporation 28 Microchip Technology Inc 24 OKI Electric Industry Co Ltd 2 Pyramid Semiconductor Corporation 10 Samsung Semiconductor 1

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Memory Density (1)

262.144 kbit 113

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EEPROM 119

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Memory Width (1)

8 113

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1 12 2 12 3 2

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1.0 99

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28 80 29 2 32 36

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32.768 k 113

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32000.0 113

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ASYNCHRONOUS 99

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70.0 °C 38 85.0 °C 28 125.0 °C 42

Min (°C) - Max (°C)

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-55.0 °C 42 -40.0 °C 28 0.0 °C 38

Min (°C) - Max (°C)

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Organization (1)

32KX8 113

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3-STATE 71

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CERAMIC 9 CERAMIC, GLASS-SEALED 17 CERAMIC, METAL-SEALED COFIRED 51 PLASTIC/EPOXY 37 UNSPECIFIED 4

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DFP 12 DIE 4 DIP 33 PGA 11 QCCJ 15 QCCN 18 SOP 8 TSSOP 2 WDIP 1 ZIP 1

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DIE OR CHIP 2 DIP28,.6 21 FL28,.4 9 LCC32,.45X.55 11 LDCC32,.45X.7 1 LDCC32,.5X.6 8 PGA28,5X6 9 SOP28,.4 2 TSSOP28,.53,22 2

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RECTANGULAR 111 SQUARE 5 UNSPECIFIED 2

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CHIP CARRIER 36 FLATPACK 12 GRID ARRAY 11 IN-LINE 44 IN-LINE, WINDOW 1 SMALL OUTLINE 8 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 2 UNCASED CHIP 4

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64 words 65

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Supply Voltage-Nom (Vsup) (1)

5 V 113

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