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27LV256-25/VS
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 X 13.40 MM, PLASTIC, VSOP-28 | 28 | unknown | EAR99 | 8542.32.00.71 | |||
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27LV256-25/L
Microchip Technology Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 3 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | unknown | EAR99 | 8542.32.00.71 | ||||
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27LV256-25/TS
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | SOP | TSSOP28/32,.8,20 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | MICROCHIP TECHNOLOGY INC | TSOP | 8 X 20 MM, PLASTIC, TSOP-28 | 28 | unknown | EAR99 | 8542.32.00.71 | |||||||
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27LV256-25I/P
Microchip Technology Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 25 µA | 5.5 V | 3 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.83 mm | 36.32 mm | 15.24 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.600 INCH, PLASTIC, DIP-28 | 28 | unknown | EAR99 | 8542.32.00.71 | |||
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27LV256-25E/TS
Microchip Technology Inc
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Check for Price | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 65 ns | OTP ROM | COMMON | 1 | 1000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | CMOS | AUTOMOTIVE | R-PDSO-G28 | Not Qualified | e0 | 125 °C | -40 °C | 28 | PLASTIC/EPOXY | TSSOP | TSSOP28/32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | DUAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.71 | ||||||||||||
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27LV256-25I/SO
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 25 µA | 5.5 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.64 mm | 17.87 mm | 7.49 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.300 INCH, PLASTIC, SOIC-28 | 28 | unknown | EAR99 | 8542.32.00.71 | ||
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27LV256-25/SO
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | 5.5 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e0 | 70 °C | 28 | PLASTIC/EPOXY | SOP | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 1.27 mm | DUAL | 2.64 mm | 17.87 mm | 7.49 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.300 INCH, PLASTIC, SOIC-28 | 28 | unknown | EAR99 | 8542.32.00.71 | |||
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27LV256-25I/TS
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 25 µA | 5.5 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | SOP | TSSOP28/32,.8,20 | RECTANGULAR | SMALL OUTLINE | YES | TIN LEAD | GULL WING | 500 µm | DUAL | MICROCHIP TECHNOLOGY INC | TSOP | 8 X 20 MM, PLASTIC, TSOP-28 | 28 | unknown | EAR99 | 8542.32.00.71 | ||||||
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27LV256-25I/VS
Microchip Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 25 µA | 5.5 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN LEAD | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 X 13.40 MM, PLASTIC, VSOP-28 | 28 | unknown | EAR99 | 8542.32.00.71 | ||
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27LV256-25I/L
Microchip Technology Inc
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | OTP ROM | DATA RETENTION >200 YEARS | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 25 µA | 5.5 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.56 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | unknown | EAR99 | 8542.32.00.71 |