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Parametric results for: 27c256-70 under OTP ROMs

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Manufacturer Part Number: 27c25670
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CY27C256-70PC
 Rochester Electronics LLC 		Check for Price Contact Manufacturer 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 e0 70 °C 28 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE DUAL ROCHESTER ELECTRONICS LLC DIP, unknown EAR99 8542.32.00.71
AM27C256-70JC
 Spansion 		Check for Price Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES J BEND 1.27 mm QUAD 3.556 mm 13.97 mm 11.43 mm SPANSION INC QCCJ, unknown EAR99 8542.32.00.71 QFJ 32
AM27C256-70EC
 AMD 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 25 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSOP1 TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm ADVANCED MICRO DEVICES INC TSOP1, TSSOP32,.8,20 unknown EAR99 8542.32.00.71 TSOP 32
CY27C256-70JIT
 Cypress Semiconductor 		Check for Price Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES J BEND QUAD CYPRESS SEMICONDUCTOR CORP QCCJ, unknown EAR99 8542.32.00.71 QFJ 32
AM27C256-70EC
 Rochester Electronics LLC 		Check for Price Contact Manufacturer 16.384 kbit 8 2KX8 5 V 100 ns OTP ROM 1 2000 32.768 k ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 70 °C 32 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm ROCHESTER ELECTRONICS LLC TSSOP, unknown EAR99 8542.32.00.71
AM27C256-70PC
 Spansion 		Check for Price Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified 70 °C 28 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 37.084 mm 15.24 mm SPANSION INC DIP-28 unknown EAR99 8542.32.00.71 DIP 28
CY27C256-70ZC
 Cypress Semiconductor 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.5 V 15 mA 45 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY SOP TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 500 µm DUAL CYPRESS SEMICONDUCTOR CORP SOP, TSSOP32,.8,20 not_compliant EAR99 8542.32.00.71 TSOP 32
AM27C256-70PI
 Spansion 		Check for Price Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDIP-T28 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 37.084 mm 15.24 mm SPANSION INC DIP-28 unknown EAR99 8542.32.00.71 DIP 28
AM27C256-70JI
 AMD 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 25 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm ADVANCED MICRO DEVICES INC QCCJ, LDCC32,.5X.6 unknown EAR99 8542.32.00.71 QFJ 32
AM27C256-70PC
 AMD 		Check for Price No Obsolete 262.144 kbit 8 32KX8 5 V 70 ns OTP ROM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 12.75 V 100 µA 25 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e0 70 °C 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.715 mm 37.084 mm 15.24 mm ADVANCED MICRO DEVICES INC PLASTIC, DIP-28 unknown EAR99 8542.32.00.71 DIP 28
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