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AM27C64-200DI
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | ||||||||||
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AM27C64-70DE
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 70 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.75 V | 100 µA | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||
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QD27C64-25
Intel Corporation
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 250 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 20 µA | CMOS | COMMERCIAL | R-XDIP-T28 | e0 | 70 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INTEL CORP | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.61 | ||||||||||||||||
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AM27C64-300LE
AMD
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 120 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||
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27C64E200/883
Texas Instruments
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Check for Price | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 13 V | 100 µA | 20 µA | CMOS | MILITARY | R-XQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | NATIONAL SEMICONDUCTOR CORP | QCCN, LCC32,.45X.55 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||||||
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8510205ZA
e2v technologies
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Check for Price | No | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 120 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 200 µA | 65 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Qualified | e0 | 125 °C | -55 °C | MIL-PRF-38535 | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | TELEDYNE E2V (UK) LTD | QFJ | CERAMIC, QCC1-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | |||||||||
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MBM27C64-30Z-W
FUJITSU Limited
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Check for Price | No | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 300 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 21 V | 30 µA | CMOS | MILITARY | R-XDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | FUJITSU LTD | DIP, DIP28,.6 | compliant | 3A001.A.2.C | 8542.32.00.61 | |||||||||||||||
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QP27C64-25/ZA
e2v technologies
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Check for Price | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 350 ns | UVPROM | 100 YEAR DATA RETENTION | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 30 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | QUAD | TELEDYNE E2V (UK) LTD | QFJ | CERAMIC, LCC-32 | 32 | compliant | 3A001.A.2.C | 8542.32.00.61 | |||||||||||||||||
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AM27C64-95DI
AMD
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Check for Price | No | No | Obsolete | 65.536 kbit | 8 | 8KX8 | 5 V | 90 ns | UVPROM | COMMON | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 100 µA | 30 µA | 5.25 V | 4.75 V | CMOS | INDUSTRIAL | R-GDIP-T28 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | EAR99 | 8542.32.00.61 | ||||||
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AM27C64-55DIB
e2v technologies
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Check for Price | Active | 65.536 kbit | 8 | 8KX8 | 5 V | 55 ns | UVPROM | 1 | 8000 | 8.192 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-CDIP-T28 | 85 °C | -40 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | TELEDYNE E2V (UK) LTD | DIP-28 | compliant | EAR99 | 8542.32.00.61 |