Filter Your Search
1 - 3 of 3 results
Select Parts | Part Number |
---|
|
25LC256-I/SN
Microchip Technology Inc
|
||
|
25LC256-I/SNG
Microchip Technology Inc
|
||
|
25LC256-I/SNRVB
Microchip Technology Inc
|
Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Composite Price
|
Pbfree Code
|
Rohs Code
|
Part Life Cycle Code
|
Memory Density
|
Memory Width | Organization |
Supply Voltage-Nom (Vsup)
|
Clock Frequency-Max (fCLK) |
Memory IC Type
|
Data Retention Time-Min
|
Endurance
|
Number of Functions | Number of Ports | Number of Words Code | Number of Words |
Operating Mode
|
Output Characteristics
|
Parallel/Serial
|
Programming Voltage
|
Reverse Pinout
|
Serial Bus Type
|
Standby Current-Max
|
Supply Current-Max
|
Supply Voltage-Max (Vsup)
|
Supply Voltage-Min (Vsup)
|
Technology |
Temperature Grade
|
Write Cycle Time-Max (tWC)
|
Write Protection
|
JESD-30 Code
|
Qualification Status
|
JESD-609 Code
|
Moisture Sensitivity Level
|
Operating Temperature-Max
|
Operating Temperature-Min
|
Peak Reflow Temperature (Cel)
|
Screening Level
|
Time@Peak Reflow Temperature-Max (s)
|
Number of Terminals
|
Package Body Material
|
Package Code
|
Package Equivalence Code
|
Package Shape
|
Package Style
|
Surface Mount
|
Terminal Finish
|
Terminal Form
|
Terminal Pitch
|
Terminal Position
|
Seated Height-Max
|
Length
|
Width
|
Ihs Manufacturer
|
Part Package Code
|
Package Description
|
Pin Count
|
Reach Compliance Code
|
ECCN Code
|
HTS Code
|
Samacsys Manufacturer
|
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 10 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | NO | SPI | 1 µA | 6 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 10 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | SPI | 1 µA | 5 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.91 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||
Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 10 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | 4.5 V | SPI | 1 µA | 6 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC-8 | compliant | EAR99 | 8542.32.00.51 |
|
25LC256-I/SN
Microchip Technology Inc
|
$1.2505 Buy | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 10 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | NO | SPI | 1 µA | 6 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||
|
25LC256-I/SNG
Microchip Technology Inc
|
Check for Price Buy | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 10 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | SPI | 1 µA | 5 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.91 mm | MICROCHIP TECHNOLOGY INC | SOIC | 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||
|
25LC256-I/SNRVB
Microchip Technology Inc
|
Check for Price Buy | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 10 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | 4.5 V | SPI | 1 µA | 6 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC-8 | compliant | EAR99 | 8542.32.00.51 |