Parametric results for: 24lc160sn under EEPROMs

All Filters Access Time-Max Additional Feature Clock Frequency-Max (fCLK) Data Retention Time-Min Endurance I/O Type I2C Control Byte JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Ports Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Power Supplies Supply Voltage-Nom (Vsup) Access Time-Max (1)

900 ns 2

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1 MILLION ERASE/WRITE CYCLES 23 1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS 43 2 WIRE INTERFACE; PAGE WRITE 12 40 YEARS DATA RETENTION 9 ALSO HAVING DIP-8 PIN PACKAGE 1 DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED 6 IT ALSO OPERATES AT 0.4MHZ AT 2.5MIN SUPPLY 2 Terminal pitch-0.26 1

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Clock Frequency-Max (fCLK) (3)

100 kHz 44 400 kHz 165 1 MHz 3

Min (MHz) - Max (MHz)

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40 28 100 39 200 146

Min - Max

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100000.0 Write/Erase Cycles 28 1000000.0 Write/Erase Cycles 140 1.0E7 Write/Erase Cycles 3

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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COMMON 2

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1010DDDR 9 1010MMMR 159 1DDDMMMR 9

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R-GDIP-T8 2 R-PBGA-B5 2 R-PDIP-T8 40 R-PDSO-G14 27 R-PDSO-G5 19 R-PDSO-G8 118 R-PDSO-N8 19 R-XUUC-N 4 R-XUUC-N4 1 S-PDSO-G8 16

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e0 55 e3 139 e4 9

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2.9 mm 13 2.95 mm 6 3 mm 35 4.4 mm 19 4.9 mm 72 4.9022 mm 1 5.05 mm 6 5.28 mm 6 8.65 mm 9 9.27 mm 7 9.271 mm 11 9.46 mm 14 9.9695 mm 3 10.03 mm 2

Min (mm) - Max (mm)

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Manufacturer (10)

Anachip Corporation 9 Catalyst Semiconductor 28 Ceramate Technical Co Ltd 3 Diodes Incorporated 9 Holtek Semiconductor Inc 7 Kodenshi Corporation 2 Kuwait Semiconductor Co Ltd 2 Microchip Technology Inc 199 Rochester Electronics LLC 1 Xicor Inc 6

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Memory Density (2)

2.048 kbit 16 16.384 kbit 234

Min (bit) - Max (bit)

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EEPROM 247 EPROM 3

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Memory Width (2)

1 1 8 249

Min - Max

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1 121 3 1

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1.0 211 8.0 4

Min - Max

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1 64

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14 27 4 1 5 14 8 202

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256 words 16 2.048 k 233 16.384 k 1

Min (words) - Max (words)

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256.0 16 2000.0 233 16000.0 1

Min - Max

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SYNCHRONOUS 215

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70.0 °C 62 85.0 °C 114 105.0 °C 5 125.0 °C 65

Min (°C) - Max (°C)

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-55.0 °C 3 -40.0 °C 181 -25.0 °C 3 0.0 °C 59

Min (°C) - Max (°C)

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Organization (3)

16KX1 1 256X8 16 2KX8 233

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OPEN-DRAIN 93

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CERAMIC, GLASS-SEALED 2 PLASTIC/EPOXY 241 UNSPECIFIED 5

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BGA 1 DIE 5 DIP 42 HVSON 16 HVSSON 3 LSSOP 19 SOP 131 TSSOP 30 VFBGA 1

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BGA5,3X3,11/10 1 DIE OR CHIP 4 DIP8(UNSPEC) 1 DIP8,.3 28 MODULE,8LEAD,.46 1 SO8(UNSPEC) 1 SOLCC8,.11,20 17 SOP14,.25 26 SOP8(UNSPEC) 1 SOP8,.19 6 SOP8,.23 9 SOP8,.25 42 SOP8,.3 3 TSOP5,.11,37 7 TSOP5/6,.11,37 7 TSSOP8,.19 4 TSSOP8,.25 17

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RECTANGULAR 232 SQUARE 16

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GRID ARRAY, VERY THIN PROFILE, FINE PITCH 2 IN-LINE 42 SMALL OUTLINE 137 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 12 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH 3 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 17 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 30 UNCASED CHIP 5

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Power Supplies (1)

3/5 V 5

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Supply Voltage-Nom (Vsup) (5)

2.4 V 1 2.5 V 6 3 V 40 3.3 V 6 5 V 162

Min (V) - Max (V)

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