Parametric results for: 24lc02 under EEPROMs

All Filters Additional Feature Clock Frequency-Max (fCLK) Data Retention Time-Min Endurance I2C Control Byte JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Ports Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup)

1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS 9 1000K ERASE/WRITE CYCLE; 200 YEAR DATA RETENTION 10 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS 9 2 WIRE INTERFACE; PAGE WRITE 24 2.5V TO 5.5V @ 0.1MHz 9 40 YEARS DATA RETENTION 15

380 hits Apply

Clock Frequency-Max (fCLK) (3)

100 kHz 57 400 kHz 223 1 MHz 20

Min (MHz) - Max (MHz)

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40 39 100 58 200 199

Min - Max

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100000.0 Write/Erase Cycles 56 1000000.0 Write/Erase Cycles 227

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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1010DDDR 189 1010XXXR 94

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R-PDIP-T8 54 R-PDSO-G14 24 R-PDSO-G5 18 R-PDSO-G6 4 R-PDSO-G8 174 R-PDSO-N8 45 R-XUUC-N 1 R-XUUC-N4 1 S-PDSO-G8 34 X-XUUC-N 1

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e0 74 e3 217 e4 16

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2 mm 8 2.9 mm 10 2.95 mm 4 3 mm 79 4.4 mm 61 4.85 mm 2 4.9 mm 78 5.05 mm 6 5.28 mm 6 8.65 mm 8 9.2 mm 3 9.27 mm 24 9.271 mm 12 9.3 mm 2 9.46 mm 9

Min (mm) - Max (mm)

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Manufacturer (10)

Anachip Corporation 15 Catalyst Semiconductor 56 Ceramate Technical Co Ltd 6 Diodes Incorporated 15 Eorex Corporation 1 Holtek Semiconductor Inc 8 Integral Research And Production Corp 2 Kodenshi Corporation 2 Kuwait Semiconductor Co Ltd 3 Microchip Technology Inc 272

380 hits Apply

Memory Density (1)

2.048 kbit 356

380 hits Apply

EEPROM 358

380 hits Apply

Memory Width (2)

1 6 8 350

Min - Max

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1 195 3 3

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1.0 315

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1 122

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14 24 4 1 5 18 6 4 8 307

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256 words 350 2.048 k 6

Min (words) - Max (words)

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256.0 350 2000.0 6

Min - Max

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SYNCHRONOUS 315

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70.0 °C 79 85.0 °C 186 125.0 °C 91

Min (°C) - Max (°C)

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-40.0 °C 277 0.0 °C 79

Min (°C) - Max (°C)

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Organization (2)

256X8 350 2KX1 6

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OPEN-DRAIN 162

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PLASTIC/EPOXY 353 UNSPECIFIED 3

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DIE 3 DIP 54 HVSON 42 HVSSON 3 LSSOP 14 SOP 152 TSSOP 88

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DIE OR CHIP 2 DIP8(UNSPEC) 1 DIP8,.3 38 MODULE,8LEAD,.46 1 SOLCC8,.11,20 27 SOLCC8,.12,20 10 SOP14,.25 24 SOP8(UNSPEC) 1 SOP8,.19 16 SOP8,.23 24 SOP8,.25 55 SOP8,.3 10 TSOP5,.11,37 3 TSOP5/6,.11,37 3 TSOP6,.11,37 4 TSSOP5/6,.08 6 TSSOP8,.19 10 TSSOP8,.25 48

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RECTANGULAR 321 SQUARE 34 UNSPECIFIED 1

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IN-LINE 54 SMALL OUTLINE 162 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 35 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH 3 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 14 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 85 UNCASED CHIP 3

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Supply Voltage-Nom (Vsup) (5)

2.5 V 21 3 V 37 3.3 V 12 4.5 V 73 5 V 167

Min (V) - Max (V)

380 hits Apply