Parametric results for: 24C640-IP under EEPROMs

All Filters Access Time-Max Additional Feature Clock Frequency-Max (fCLK) Command User Interface Data Polling Data Retention Time-Min Endurance I2C Control Byte JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Ports Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Page Size Power Supplies Supply Voltage-Nom (Vsup) Access Time-Max (2)

3.5 ps 5 900 ns 15

Min (ns) - Max (ns)

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1.7V TO 5.5V @ 0.4MHz 5 100 YEAR DATA RETENTION 28 2-WIRE SERIAL INTERFACE 30 ALSO AVAILABLE 1.7-5.5V OPERATES WITH 0.1MHZ, 1.7-5.5V OPERATES WITH 0.4MHZ 1 ALSO OPERATES 1.7V AT 100 KHZ 2 ALSO OPERATES 1.7V AT 400 KHZ 2 ALSO OPERATES AT 0.4MHZ AT 1.7MIN SUPPLY 3 DATA RETENTION TIME @ 55 DEGREE CENTIGRADE 262 DATA RETENTION: 100 YEARS 57 HARDWARE WRITE PROTECTION; DATA RETENTION 100 YEARS; 1 MILLION ENDURANCE CYCLES 8 I2C BUS SERIAL INTERFACE; AUTOMATIC WRITE 56 IT ALSO OPERATES AT 0 TO 85 TEMP AT WRITE OPERATION 8 IT ALSO OPERATES AT 0.4 MHZ FREQUENCY AT 1.7 TO 2.5 V SUPPLY VOLTAGE 2 IT ALSO OPERATES AT 0.4MHZ AT 1.8MIN SUPPLY 17 IT ALSO OPERATES AT FREQUENCY 0.4 MHZ AT 1.7 TO 2.5V SUPPLY VOLTAGE 1 LEGTH-0.76 MM 1 SEATED HGT-NOM 1 TERM PITCH-MAX 2

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Clock Frequency-Max (fCLK) (5)

100 kHz 239 400 kHz 655 750 kHz 4 800 kHz 11 1 MHz 452

Min (MHz) - Max (MHz)

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NO 1

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YES 5

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10 2 25 3 40 153 100 449 200 277

Min - Max

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100000.0 Write/Erase Cycles 92 200000.0 Write/Erase Cycles 3 1000000.0 Write/Erase Cycles 860 1200000.0 Write/Erase Cycles 262

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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1010000R 13 1010DDDR 1,097 1010XXXR 47

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R-GDIP-T8 4 R-PBGA-B6 5 R-PBGA-B8 6 R-PDIP-T8 346 R-PDSO-G14 58 R-PDSO-G5 2 R-PDSO-G8 1,295 R-PDSO-N5 52 R-PDSO-N8 132 R-XBCC-B5 12 R-XBCS-B4 143 R-XBCS-B5 112 R-XBCS-B8 172 R-XDMA-N8 1 R-XDSO-G8 19 R-XDSO-N8 105 R-XXMA-X8 2 S-PBGA-B4 15 S-PBGA-B5 4 S-PDSO-G8 12 S-XDFP-F8 4 S-XQCC-N20 4 X-PBGA-B4 2 X-XUUC-N 15 X-XXMA-X8 6

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e0 540 e1 7 e2 7 e3 391 e4 417

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731 µm 13 750 µm 7 760 µm 5 770 µm 3 795 µm 124 833 µm 4 851 µm 2 1.073 mm 236 1.7 mm 64 1.805 mm 48 2 mm 4 2.2 mm 3 2.3 mm 4 2.9 mm 3 2.92 mm 2 3 mm 212 3.73 mm 1 4.4 mm 523 4.89 mm 6 4.9 mm 539 4.9025 mm 4 4.925 mm 23 4.93 mm 4 5 mm 19 5.02 mm 4 5.23 mm 4 5.255 mm 4 5.29 mm 4 5.3 mm 45 5.31 mm 28 6 mm 1 6.477 mm 4 8.65 mm 32 8.89 mm 4 9.2 mm 2 9.25 mm 1 9.27 mm 221 9.271 mm 23 9.3 mm 1 9.3218 mm 2 9.325 mm 26 9.36 mm 8 9.4 mm 4 9.52 mm 2 9.55 mm 8 9.59 mm 6 9.817 mm 24

Min (mm) - Max (mm)

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Manufacturer (23)

ABLIC Inc. 9 Adesto Technologies Corporation 26 Atmel Corporation 171 Catalyst Semiconductor 168 Dialog Semiconductor GmbH 19 Fairchild Semiconductor Corporation 90 Force Technologies Ltd 16 Fremont Micro Devices (USA) Inc 20 Giantec Semiconductor Inc 19 Infineon Technologies AG 12 Integrated Silicon Solution Inc 78 LRC Leshan Radio Co Ltd 3 Microchip Technology Inc 95 onsemi 106 Rochester Electronics LLC 42 ROHM Semiconductor 5 Seiko Instruments Inc 1 Shanghai Belling Co Ltd 6 Shanghai Fudan Microelectronics Group Co Limited 29 Siemens 12 STMicroelectronics 2,278 Turbo Ic Inc 4 Twilight Technology Inc 12

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Memory Density (3)

32.768 kbit 1 65.536 kbit 2,522 67.1089 Mbit 5

Min (bit) - Max (bit)

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EEPROM 2,574 EEPROM CARD 7

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Memory Width (2)

1 33 8 2,496

Min - Max

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1 644 2 3 3 12 NOT APPLICABLE 42 NOT SPECIFIED 5

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1.0 2,396

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1 62

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14 58 20 4 4 160 5 182 6 5 8 2,104

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4.096 k 1 8.192 k 2,490 65.536 k 33 8.3886 M 5

Min (words) - Max (words)

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4000.0 1 8000.0 2,482 8192.0 8 64000.0 33 8000000.0 5

Min - Max

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ASYNCHRONOUS 1 SYNCHRONOUS 2,395

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70.0 °C 227 75.0 °C 1 85.0 °C 1,779 105.0 °C 51 125.0 °C 462 175.0 °C 8

Min (°C) - Max (°C)

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-55.0 °C 16 -40.0 °C 1,985 -30.0 °C 1 -20.0 °C 299 0.0 °C 227

Min (°C) - Max (°C)

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Organization (5)

4KX8 1 64KX1 33 8192X8 8 8KX8 2,482 8MX8 5

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OPEN-DRAIN 528

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CERAMIC, GLASS-SEALED 4 PLASTIC/EPOXY 2,234 UNSPECIFIED 154

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CSP 427 DFP 4 DIE 15 DIP 350 HSON 1 HVSON 197 HVSSON 1 HVSSOP 6 LSOP 1 LSSOP 2 QCCN 4 SON 23 SOP 803 TSSOP 566 VBCC 12 VFBGA 31 VSON 67 VSSOP 8

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BGA4,2X2,16 11 BGA4,2X2,20/16 135 BGA5,3X3,14/8 85 BGA6,2X3,16 1 BGA8,2X4,30 1 BGA8,2X4,40/20 2 BGA8,3X5,14/8 124 BGA8,3X5,44/25 48 DIP8(UNSPEC) 2 DIP8,.3 159 MODULE,8LEAD,.46 8 SOLCC5,.06,16 32 SOLCC8,.08,16 3 SOLCC8,.11,20 111 SOLCC8,.12,20 24 SOLCC8,.2,25 13 SOP14,.25 11 SOP8(UNSPEC) 2 SOP8,.23 6 SOP8,.24 1 SOP8,.25 337 SOP8,.3 60 SSOP8,.12,20 1 TSOP5/6,.11,37 2 TSSOP14,.25 11 TSSOP8,.12,20 1 TSSOP8,.16 11 TSSOP8,.19 11 TSSOP8,.25 261

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RECTANGULAR 2,332 SQUARE 174 UNSPECIFIED 23

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CHIP CARRIER 4 CHIP CARRIER, VERY THIN PROFILE 12 CHIP SCALE 343 FLATPACK 4 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 115 IN-LINE 350 MICROELECTRONIC ASSEMBLY 9 SMALL OUTLINE 825 SMALL OUTLINE, HEAT SINK/SLUG 1 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 196 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH 8 SMALL OUTLINE, LOW PROFILE 1 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 3 SMALL OUTLINE, THIN PROFILE 1 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 565 SMALL OUTLINE, VERY THIN PROFILE 67 SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH 8 UNCASED CHIP 15

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32 words 13

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Power Supplies (3)

1.8/5 V 4 2/5 V 9 3/5 V 23

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Supply Voltage-Nom (Vsup) (6)

1.8 V 447 2.5 V 544 2.7 V 151 3 V 115 3.3 V 555 5 V 525

Min (V) - Max (V)

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