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24AA08I/MNY
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 100 kHz | EEPROM | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | DFN | HVSON, | 8 | compliant | ||||||||||||||
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24AA08-I/MNY
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 8.192 kbit | 8 | 1KX8 | 2.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XMMR | 1 | 1000 | 1.024 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip |