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ZMD31020BIC
Integrated Device Technology Inc
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Check for Price | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-XUUC-N14 | Not Qualified | 125 °C | -40 °C | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UPPER | INTEGRATED DEVICE TECHNOLOGY INC | DIE, | compliant | 8542.39.00.01 | |||||||||||||||
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ZMD31020BIC
ZMDI
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Check for Price | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-XUUC-N14 | Not Qualified | 125 °C | -40 °C | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UPPER | ZENTRUM MIKROELEKTRONIK DRESDEN AG | DIE, | compliant | 8542.39.00.01 | DIE | 14 | |||||||||||||
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ZMD31020BIF-R
ZMDI
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Check for Price | No | No | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G14 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 240 | 30 | 14 | PLASTIC/EPOXY | SSOP | TSOP16/14,.30 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | DUAL | 6.2 mm | 1.99 mm | 5.3 mm | ZENTRUM MIKROELEKTRONIK DRESDEN AG | SSOP, | compliant | 8542.39.00.01 | SSOP | 14 | ||
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ZMD31020BIF-T
Integrated Device Technology Inc
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Check for Price | No | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G14 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 14 | PLASTIC/EPOXY | SSOP | TSOP16/14,.30 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 6.2 mm | 1.99 mm | 5.3 mm | INTEGRATED DEVICE TECHNOLOGY INC | SSOP, | compliant | 8542.39.00.01 | |||||||
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ZMD31020BIF-T
ZMDI
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Check for Price | No | No | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G14 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 240 | 30 | 14 | PLASTIC/EPOXY | SSOP | TSOP16/14,.30 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | DUAL | 6.2 mm | 1.99 mm | 5.3 mm | ZENTRUM MIKROELEKTRONIK DRESDEN AG | SSOP, | compliant | 8542.39.00.01 | SSOP | 14 | ||
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ZMD31020BIF-R
Integrated Device Technology Inc
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Check for Price | No | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-PDSO-G14 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 14 | PLASTIC/EPOXY | SSOP | TSOP16/14,.30 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 6.2 mm | 1.99 mm | 5.3 mm | INTEGRATED DEVICE TECHNOLOGY INC | SSOP, | compliant | 8542.39.00.01 | |||||||
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ZMD31020BID
Integrated Device Technology Inc
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Check for Price | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-XUUC-N14 | Not Qualified | 125 °C | -40 °C | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UPPER | INTEGRATED DEVICE TECHNOLOGY INC | DIE, | compliant | 8542.39.00.01 | |||||||||||||||
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ZMD31020BIB
ZMDI
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Check for Price | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-XUUC-N14 | Not Qualified | 125 °C | -40 °C | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UPPER | ZENTRUM MIKROELEKTRONIK DRESDEN AG | DIE, | compliant | 8542.39.00.01 | DIE | 14 | |||||||||||||
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ZMD31020BID
ZMDI
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Check for Price | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-XUUC-N14 | Not Qualified | 125 °C | -40 °C | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UPPER | ZENTRUM MIKROELEKTRONIK DRESDEN AG | DIE, | compliant | 8542.39.00.01 | DIE | 14 | |||||||||||||
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ZMD31020BIB
Integrated Device Technology Inc
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Check for Price | Transferred | 5 V | YES | ANALOG CIRCUIT | CMOS | 1 | 5.5 V | 4.5 V | AUTOMOTIVE | R-XUUC-N14 | Not Qualified | 125 °C | -40 °C | 14 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UPPER | INTEGRATED DEVICE TECHNOLOGY INC | DIE, | compliant | 8542.39.00.01 |