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1N958B
Microsemi Corporation
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$2.4087 | No | No | Transferred | 950 µA | 400 mW | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5.5 Ω | 5 % | Not Qualified | O-LALF-W2 | DO-7 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS PACAKGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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1N958B
Microchip Technology Inc
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$2.4211 | No | Active | 950 µA | 400 mW | 130 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5.5 Ω | 5 % | Not Qualified | O-LALF-W2 | DO-7 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACAKGE-2 | compliant | Microchip | ||||||||||||||
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1N958A
Microchip Technology Inc
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$2.4211 | No | Active | 16.5 mA | 417 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5.5 Ω | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | |||||||||||||||
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1N958B-1E3
Microchip Technology Inc
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$2.6097 | Yes | Active | 16.5 mA | 75 µA | 400 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5.5 Ω | 700 Ω | 5.7 V | 4.35 mV/°C | 5 % | O-LALF-W2 | e3 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | |||||||||||
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1N958B-1E3/TR
Microchip Technology Inc
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$2.8067 | Yes | Active | 16.5 mA | 75 µA | 400 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5.5 Ω | 700 Ω | 5.7 V | 4.35 mV/°C | 5 % | O-LALF-W2 | e3 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Matte Tin (Sn) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | |||||||||||
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1N958D-1E3/TR
Microsemi Corporation
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Check for Price | Yes | Transferred | 16.5 mA | 500 mW | 7.5 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 5.5 Ω | 1 % | e3 | 175 °C | Matte Tin (Sn) | MICROSEMI CORP | compliant | EAR99 | 8541.10.00.50 | |||||||||||||||||||||||||||
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MQ1N958CTR
Microsemi Corporation
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Check for Price | No | Obsolete | 16.5 mA | 417 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | O-LALF-W2 | 2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||
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JANTXV1N958B-1
Defense Logistics Agency
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Check for Price | Obsolete | 16.5 mA | 480 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-204AH | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | ||||||||||||||||
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TC1N958B
Tak Cheong Electronics (Holdings) Co Ltd
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Check for Price | Yes | Yes | Active | 16.5 mA | 500 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 5.5 Ω | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-35 | 200 °C | 250 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | TAK CHEONG ELECTRONICS HOLDINGS CO LTD | DO-35 | O-LALF-W2 | 2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
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JAN1N958D
Cobham Semiconductor Solutions
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Check for Price | Transferred | 16.5 mA | 500 mW | 7.5 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | DO-35 | O-LALF-W2 | 2 | unknown | EAR99 | 8541.10.00.50 |