Parametric results for: 1n944 under Zener Diodes
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1N944
Microsemi Corporation
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$21.5172 | No | No | Transferred | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS, DO-7 | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||
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1N944A
Microsemi Corporation
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$21.5172 | No | No | Transferred | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS, DO-7 | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||
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1N944A
Microchip Technology Inc
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$23.2762 | No | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | |||||||||||||
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1N944A-1E3
Microchip Technology Inc
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$23.4776 | Yes | Active | 7.5 mA | 500 mW | 11.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | O-LALF-W2 | e3 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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1N944B
Microchip Technology Inc
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$25.2179 | No | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | |||||||||||
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1N944BE3
Microchip Technology Inc
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$25.6094 | Yes | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | O-LALF-W2 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | ||||||||||||||||
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1N944
Microchip Technology Inc
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$34.1229 | No | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7 | compliant | ||||||||||
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1N944/TR
Microchip Technology Inc
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$34.3343 | Active | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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JAN1N944B-1
Microsemi Corporation
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$200.1000 | No | No | Transferred | 500 mW | 11.7 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.117 mV/°C | 4.96 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||
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1N944UR-1-1%E3
Microsemi Corporation
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Check for Price | Transferred | ZENER DIODE | MICROSEMI CORP | compliant | EAR99 | 8541.10.00.50 |