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1N937B-1
Microchip Technology Inc
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$10.2748 | No | Active | 7.5 mA | 500 mW | 9 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.18 mV/°C | 5 % | O-LALF-W2 | e0 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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JANTX1N937B-1
Microsemi Corporation
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$130.7128 | No | No | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.18 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||
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1N937B-1
Compensated Devices Inc
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Check for Price | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.18 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | COMPENSATED DEVICES INC | HERMETIC SEALED, DO-35, 2 PIN | unknown | |||||||||||||||
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JAN1N937B-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.18 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | |||||
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1N937B-1E3TR
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.18 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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1N937B-1TR
Microsemi Corporation
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Check for Price | No | No | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.18 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | compliant | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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1N937B-1-2%E3
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 500 mW | 9.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.184 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | compliant | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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JANTXV1N937B-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.18 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | |||||
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JANTX1N937B-1
Microchip Technology Inc
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Check for Price | No | Active | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.18 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||
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JAN1N937B-1
Microchip Technology Inc
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Check for Price | No | Active | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.18 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |