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1 - 10 of 307 results
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JAN1N6642US/TR
Microchip Technology Inc
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$6.3419 | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.70 | |||||||||||||||
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1N6642US
Microsemi Corporation
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$6.8127 | No | No | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.70 | HERMETIC SEALED, GLASS, D-5D, 2 PIN | Microsemi Corporation | ||||||||||||
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1N6642US
Microchip Technology Inc
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$6.9888 | No | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, D-5D, 2 PIN | Microchip | |||||||||||||||
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1N6642U
Microchip Technology Inc
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$6.9888 | No | Active | 300 mA | 1.2 V | 5 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Not Qualified | O-LELF-R2 | e0 | 200 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, D-5D, 2 PIN | Microchip | |||||||||
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1N6642U/TR
Microchip Technology Inc
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$7.1688 | Active | RECTIFIER DIODE | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | Microchip | ||||||||||||||||||||||||||||||||||||
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1N6642UE3
Microchip Technology Inc
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$7.1881 | Active | 300 mA | 5 ns | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | O-LELF-R2 | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, D-5D, 2 PIN | Microchip | |||||||||||||||||
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JANTX1N6642U
Cobham Semiconductor Solutions
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$7.1886 | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | NO | 75 V | 1 | Not Qualified | O-LALF-W2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | unknown | EAR99 | 8541.10.00.70 | HERMETIC SEALED GLASS PACKAGE-2 | 2 | |||||||||||||||
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1N6642USE3
Microchip Technology Inc
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$7.2481 | Yes | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | 1 | O-LELF-R2 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ROHS COMPLIANT, HERMETIC SEALED, GLASS, D-5B, SQ-MELF, B PACKAGE-2 | Microchip | |||||||||||||||||
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JANTX1N6642U
Microchip Technology Inc
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$7.5031 | No | Active | 300 mA | 1.2 V | 5 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 200 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | SURFACEMOUNT PACKAGE-2 | |||||||||
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JANTX1N6642US/TR
Microchip Technology Inc
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$7.6673 | Active | 300 mA | 1.2 V | 5 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.80 |