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1N6467US
Semtech Corporation
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$1.0000 | No | No | Transferred | 63.5 V | 3 W | SILICON | 43.7 V | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 40.3 V | 1 | AVALANCHE | HIGH RELIABILITY | Not Qualified | O-LELF-N2 | e0 | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | NO LEAD | END | SEMTECH CORP | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | |||||||||
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JAN1N6467US
Semtech Corporation
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$1.0000 | Transferred | 63.5 V | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 40.3 V | 1 | AVALANCHE | 500 W | Qualified | O-XELF-R2 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | SURFACE MOUNT PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||
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1N6467
Microsemi Corporation
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$10.1745 | No | No | Transferred | 63.5 V | 2.5 W | 44 V | SILICON | 43.7 V | TRANS VOLTAGE SUPPRESSOR DIODE | BIDIRECTIONAL | SINGLE | NO | 40.3 V | 1 | AVALANCHE | TEMPERATURE COEFFICIENT IS DERIVED FROM MINIMUM BREAK-DOWN VOLTAGE | 500 W | Not Qualified | O-LALF-W2 | e0 | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | GLASS, E PACKAGE, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | E PACKAGE | |||
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JANTX1N6467
Microsemi Corporation
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$12.1786 | No | No | Transferred | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 40.3 V | 1 | AVALANCHE | 500 W | Not Qualified | O-XALF-W2 | e0 | MIL-19500/551C | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | 2 | unknown | EAR99 | 8541.10.00.50 | E PACKAGE | |||||||
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JAN1N6467
Microchip Technology Inc
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$12.6601 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 40.3 V | 1 | AVALANCHE | 500 W | Qualified | O-XALF-W2 | e0 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||
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1N6467
Microchip Technology Inc
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$12.8864 | No | Active | 63.5 V | 2.5 W | 44 V | SILICON | 43.7 V | TRANS VOLTAGE SUPPRESSOR DIODE | BIDIRECTIONAL | SINGLE | NO | 40.3 V | 1 | AVALANCHE | TEMPERATURE COEFFICIENT IS DERIVED FROM MINIMUM BREAK-DOWN VOLTAGE | 500 W | Not Qualified | O-LALF-W2 | e0 | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | GLASS, E PACKAGE, 2 PIN | compliant | ||||||||
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JANTX1N6467
Microchip Technology Inc
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$14.0063 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 40.3 V | 1 | AVALANCHE | 500 W | Qualified | O-XALF-W2 | e0 | MIL-19500/551C | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||
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JANTXV1N6467US
Semtech Corporation
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$14.1592 | Transferred | 63.5 V | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 40.3 V | 1 | AVALANCHE | 500 W | Qualified | O-XELF-R2 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | SURFACE MOUNT PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||
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JAN1N6467US
Microchip Technology Inc
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$14.5619 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 40.3 V | 1 | AVALANCHE | 500 W | Qualified | O-XELF-R2 | e0 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACE MOUNT PACKAGE-2 | compliant | |||||||||||||
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JAN1N6467US/TR
Microchip Technology Inc
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$14.7262 | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 40.3 V | 1 | AVALANCHE | 500 W | Qualified | O-XELF-R2 | e0 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 |