Findchips: Parametric Search Results for 1n6320us

Parametric results for: 1n6320us under Zener Diodes

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		1N6320US Microchip Technology Inc
		JAN1N6320US Microchip Technology Inc
		1N6320US/TR Microchip Technology Inc
		JANTX1N6320US Microchip Technology Inc
		JANTXV1N6320US Microchip Technology Inc
		JANS1N6320US Microchip Technology Inc
		JANTXV1N6320US MACOM
		JANTXV1N6320US Compensated Devices Inc
		JANS1N6320USC VPT Components
		1N6320USE3 Microsemi Corporation

			Most Relevant											Technical						Compliance				Operating Conditions				Physical								Other
Composite Price	Rohs Code	Part Life Cycle Code	Working Test Current	Reverse Current-Max	Power Dissipation-Max	Reference Voltage-Nom	Diode Element Material	Diode Type	Polarity	Configuration	Surface Mount	Number of Elements	Technology	Additional Feature	Dynamic Impedance-Max	Knee Impedance-Max	Reverse Test Voltage	Voltage Temp Coeff-Max	Voltage Tol-Max	Qualification Status	JESD-30 Code	JESD-609 Code	Reference Standard	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

$14.3939

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Not Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

$15.7481

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

$16.2587

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Not Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

NOT SPECIFIED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

unknown

EAR99

8541.10.00.50

$21.5607

Active

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

5 %

Qualified

O-XELF-R2

MIL-19500/533F

175 °C

-65 °C

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

compliant

$22.0650

Active

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

$140.1783

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

Check for Price

Transferred

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

WRAP AROUND

END

M/A-COM TECHNOLOGY SOLUTIONS INC

MELF-2

compliant

EAR99

8541.10.00.50

Check for Price

Transferred

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-XELF-R2

MIL-19500/533F

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

WRAP AROUND

END

COMPENSATED DEVICES INC

HERMETIC SEALED, GLASS, D-5D, 2 PIN

unknown

Check for Price

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY

3 Ω

400 Ω

4 V

4.216 mV/°C

2 %

O-LELF-R2

MIL-PRF-19500; MIL-STD-750

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

VPT COMPONENTS

unknown

EAR99

8541.10.00.50

Check for Price

Yes

Transferred

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

5 %

O-LELF-R2

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

PURE MATTE TIN

WRAP AROUND

END

MICROSEMI CORP

O-LELF-R2

compliant

EAR99

8541.10.00.50

1 2 3 4 5 Next

Compare

1N6320US

Microchip Technology Inc

$14.3939

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Not Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

JAN1N6320US

Microchip Technology Inc

$15.7481

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

1N6320US/TR

Microchip Technology Inc

$16.2587

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Not Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

NOT SPECIFIED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

unknown

EAR99

8541.10.00.50

JANTX1N6320US

Microchip Technology Inc

$21.5607

Active

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

5 %

Qualified

O-XELF-R2

MIL-19500/533F

175 °C

-65 °C

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

compliant

JANTXV1N6320US

Microchip Technology Inc

$22.0650

Active

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

JANS1N6320US

Microchip Technology Inc

$140.1783

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

400 Ω

4 V

5 %

Qualified

O-LELF-R2

MIL-19500

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

MELF-2

compliant

JANTXV1N6320US

MACOM

Check for Price

Transferred

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

WRAP AROUND

END

M/A-COM TECHNOLOGY SOLUTIONS INC

MELF-2

compliant

EAR99

8541.10.00.50

JANTXV1N6320US

Compensated Devices Inc

Check for Price

Transferred

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-XELF-R2

MIL-19500/533F

ISOLATED

UNSPECIFIED

ROUND

LONG FORM

WRAP AROUND

END

COMPENSATED DEVICES INC

HERMETIC SEALED, GLASS, D-5D, 2 PIN

unknown

JANS1N6320USC

VPT Components

Check for Price

Active

20 mA

2 µA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY

3 Ω

400 Ω

4 V

4.216 mV/°C

2 %

O-LELF-R2

MIL-PRF-19500; MIL-STD-750

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

Tin/Lead (Sn/Pb)

WRAP AROUND

END

VPT COMPONENTS

unknown

EAR99

8541.10.00.50

1N6320USE3

Microsemi Corporation

Check for Price

Yes

Transferred

20 mA

500 mW

6.8 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

HIGH RELIABILITY, METALLURGICALLY BONDED

3 Ω

5 %

O-LELF-R2

175 °C

-65 °C

ISOLATED

GLASS

ROUND

LONG FORM

PURE MATTE TIN

WRAP AROUND

END

MICROSEMI CORP

O-LELF-R2

compliant

EAR99

8541.10.00.50

1 2 3 4 5 Next