Filter Your Search
1 - 10 of 66 results
Select Parts | Part Number |
---|
|
1N5919AG
Microchip Technology Inc
|
||
|
1N5919A
Microchip Technology Inc
|
||
|
1N5919A
Jinan Gude Electronic Device Co Ltd
|
||
|
1N5919A
Motorola Mobility LLC
|
||
|
MSP1N5919AUR-1
Microchip Technology Inc
|
||
|
MV1N5919AGTR
Microsemi Corporation
|
||
|
1N5919A-B
Micro Commercial Components
|
||
|
1N5919A
Daco Semiconductor Co Ltd
|
||
|
1N5919AUR-1
Microsemi Corporation
|
||
|
MQ1N5919AUR-1
Microsemi Corporation
|
Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | |||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Composite Price
|
Pbfree Code
|
Rohs Code
|
Part Life Cycle Code
|
Working Test Current
|
Reverse Current-Max
|
Power Dissipation-Max
|
Reference Voltage-Nom
|
Diode Element Material
|
Diode Type | Polarity | Configuration |
Surface Mount
|
Number of Elements | Technology |
Additional Feature
|
Dynamic Impedance-Max
|
Knee Impedance-Max
|
Voltage Tol-Max
|
Qualification Status
|
JESD-30 Code
|
JESD-609 Code
|
Reference Standard
|
JEDEC-95 Code
|
Moisture Sensitivity Level
|
Operating Temperature-Max
|
Operating Temperature-Min
|
Peak Reflow Temperature (Cel)
|
Time@Peak Reflow Temperature-Max (s)
|
Case Connection
|
Number of Terminals
|
Package Body Material
|
Package Shape
|
Package Style
|
Terminal Finish
|
Terminal Form
|
Terminal Position
|
Ihs Manufacturer
|
Package Description
|
Reach Compliance Code
|
ECCN Code
|
HTS Code
|
Part Package Code
|
Pin Count
|
No | Active | 66.9 mA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-41, 2 PIN | compliant | ||||||||||||||
No | Active | 66.9 mA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||
Contact Manufacturer | 66.9 mA | 1.5 W | 5.6 V | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | 2 Ω | 10 % | O-PALF-W2 | DO-41 | 175 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | WIRE | AXIAL | JINAN GUDE ELECTRONIC DEVICE CO LTD | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||||||
No | Obsolete | 66.9 mA | 5 µA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 Ω | 250 Ω | 10 % | Not Qualified | O-PALF-W2 | e0 | DO-41 | 200 °C | -55 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MOTOROLA INC | O-PALF-W2 | unknown | EAR99 | 8541.10.00.50 | |||||||||
No | Active | 66.9 mA | 1.25 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 % | O-LELF-R2 | e0 | MIL-19500 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | EAR99 | 8541.10.00.50 | |||||||||||
No | No | Transferred | 66.9 mA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | compliant | EAR99 | 8541.10.00.50 | DO-41 | 2 | ||||||||
No | Obsolete | e0 | 240 | 30 | TIN LEAD | MICRO COMMERCIAL COMPONENTS | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||||||||||||||||||||||
Contact Manufacturer | DACO SEMICONDUCTOR CO LTD | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||||||||||||||||||||||||||
No | No | Transferred | 66.9 mA | 1.25 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 % | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AB | 2 | |||||||||
No | No | Transferred | 66.9 mA | 1.25 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 % | O-LELF-R2 | e0 | MIL-19500 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | MELF-2 | compliant | EAR99 | 8541.10.00.50 | DO-213AB | 2 |
|
1N5919AG
Microchip Technology Inc
|
$3.1159 | No | Active | 66.9 mA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-41, 2 PIN | compliant | |||||||||||||||
|
1N5919A
Microchip Technology Inc
|
$3.1159 | No | Active | 66.9 mA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||||||
|
1N5919A
Jinan Gude Electronic Device Co Ltd
|
Check for Price | Contact Manufacturer | 66.9 mA | 1.5 W | 5.6 V | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | 2 Ω | 10 % | O-PALF-W2 | DO-41 | 175 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | WIRE | AXIAL | JINAN GUDE ELECTRONIC DEVICE CO LTD | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||||||||
|
1N5919A
Motorola Mobility LLC
|
Check for Price | No | Obsolete | 66.9 mA | 5 µA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 Ω | 250 Ω | 10 % | Not Qualified | O-PALF-W2 | e0 | DO-41 | 200 °C | -55 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MOTOROLA INC | O-PALF-W2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||
|
MSP1N5919AUR-1
Microchip Technology Inc
|
Check for Price | No | Active | 66.9 mA | 1.25 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 % | O-LELF-R2 | e0 | MIL-19500 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | EAR99 | 8541.10.00.50 | ||||||||||||
|
MV1N5919AGTR
Microsemi Corporation
|
Check for Price | No | No | Transferred | 66.9 mA | 1.5 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | compliant | EAR99 | 8541.10.00.50 | DO-41 | 2 | |||||||||
|
1N5919A-B
Micro Commercial Components
|
Check for Price | No | Obsolete | e0 | 240 | 30 | TIN LEAD | MICRO COMMERCIAL COMPONENTS | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||||||||||||||||||||||
|
1N5919A
Daco Semiconductor Co Ltd
|
Check for Price | Contact Manufacturer | DACO SEMICONDUCTOR CO LTD | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||||||||||||||||||||||||||||
|
1N5919AUR-1
Microsemi Corporation
|
Check for Price | No | No | Transferred | 66.9 mA | 1.25 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 % | O-LELF-R2 | e0 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AB | 2 | ||||||||||
|
MQ1N5919AUR-1
Microsemi Corporation
|
Check for Price | No | No | Transferred | 66.9 mA | 1.25 W | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 % | O-LELF-R2 | e0 | MIL-19500 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | MELF-2 | compliant | EAR99 | 8541.10.00.50 | DO-213AB | 2 |