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1N4625D-1
Microchip Technology Inc
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$5.7756 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 Ω | 1 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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1N4625D
Microchip Technology Inc
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$6.7732 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 kΩ | 1 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N4625D-1
Microsemi Corporation
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$11.7496 | No | Transferred | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7, 2 PIN | unknown | ||||||||||||
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JAN1N4625D-1
Microchip Technology Inc
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$12.3630 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | ||||||||||||
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JANTX1N4625D-1
Microchip Technology Inc
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$13.2614 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 Ω | 1 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | ||||||||||
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JANTX1N4625D-1
Microsemi Corporation
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$14.2715 | No | Transferred | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 Ω | 1 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7, 2 PIN | unknown | ||||||||||
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1N4625DUR-1
Microchip Technology Inc
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$15.4225 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1 % | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | compliant | Microchip | ||||||||||||
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JANTXV1N4625D-1
Microsemi Corporation
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$18.0838 | No | No | Transferred | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 Ω | 1 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | |||||
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JANTXV1N4625D-1
Microchip Technology Inc
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$19.0241 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 Ω | 1 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 200 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | ||||||||||
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JAN1N4625DUR-1
Microsemi Corporation
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$19.0785 | No | Transferred | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/435F | DO-213AA | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA, 2 PIN | unknown |