Findchips: Parametric Search Results for 1n4488us

Parametric results for: 1n4488us under Zener Diodes

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		JAN1N4488US Microchip Technology Inc
		1N4488US Microchip Technology Inc
		JANTX1N4488US Microchip Technology Inc
		JANTXV1N4488US Microchip Technology Inc
		1N4488USD Microsemi Corporation
		JANS1N4488US Sensitron Semiconductors
		1N4488USC Microsemi Corporation
		JANS1N4488US Microchip Technology Inc
		JAN1N4488US Microsemi Corporation
		JANTX1N4488US Microsemi Corporation

				Most Relevant										Technical			Compliance				Operating Conditions			Physical								Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Working Test Current	Power Dissipation-Max	Reference Voltage-Nom	Diode Element Material	Diode Type	Polarity	Configuration	Surface Mount	Number of Elements	Technology	Additional Feature	Dynamic Impedance-Max	Voltage Tol-Max	Qualification Status	JESD-30 Code	JESD-609 Code	Reference Standard	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	Pin Count	ECCN Code	HTS Code

$10.7693

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

$11.6961

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

O-LELF-R2

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

compliant

$15.5914

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

$18.1615

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

200 Ω

1 %

O-LELF-R2

175 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

Check for Price

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

200 Ω

5 %

Qualified

O-LELF-R2

MIL-19500/406F

175 °C

NOT SPECIFIED

ISOLATED

GLASS

ROUND

LONG FORM

WRAP AROUND

END

SENSITRON SEMICONDUCTOR

compliant

EAR99

8541.10.00.50

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

200 Ω

2 %

O-LELF-R2

175 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

Check for Price

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

200 Ω

5 %

Qualified

O-LELF-R2

MIL-19500/406F

175 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS, D-5A, 2 PIN

compliant

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

1 2 3 4 5 Next

Compare

JAN1N4488US

Microchip Technology Inc

$10.7693

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

1N4488US

Microchip Technology Inc

$11.6961

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

O-LELF-R2

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

compliant

JANTX1N4488US

Microchip Technology Inc

$15.5914

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

JANTXV1N4488US

Microchip Technology Inc

$18.1615

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS PACKAGE-2

compliant

1N4488USD

Microsemi Corporation

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

200 Ω

1 %

O-LELF-R2

175 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

JANS1N4488US

Sensitron Semiconductors

Check for Price

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

200 Ω

5 %

Qualified

O-LELF-R2

MIL-19500/406F

175 °C

NOT SPECIFIED

ISOLATED

GLASS

ROUND

LONG FORM

WRAP AROUND

END

SENSITRON SEMICONDUCTOR

compliant

EAR99

8541.10.00.50

1N4488USC

Microsemi Corporation

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

200 Ω

2 %

O-LELF-R2

175 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

JANS1N4488US

Microchip Technology Inc

Check for Price

Active

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

200 Ω

5 %

Qualified

O-LELF-R2

MIL-19500/406F

175 °C

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED, GLASS, D-5A, 2 PIN

compliant

JAN1N4488US

Microsemi Corporation

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

JANTX1N4488US

Microsemi Corporation

Check for Price

Transferred

2.8 mA

1.5 W

91 V

SILICON

ZENER DIODE

UNIDIRECTIONAL

SINGLE

YES

ZENER

METALLURGICALLY BONDED

5 %

Not Qualified

O-LELF-R2

MIL-19500

ISOLATED

GLASS

ROUND

LONG FORM

TIN LEAD

WRAP AROUND

END

MICROSEMI CORP

HERMETIC SEALED, GLASS PACKAGE-2

unknown

EAR99

8541.10.00.50

1 2 3 4 5 Next