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JANTX1N4481
Semtech Corporation
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$1.0000 | Transferred | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 50 Ω | 4.89 % | Qualified | O-XALF-W2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | HERMETIC SEALED, G99, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | SEMTECH | ||||||||||
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JANTXV1N4481US
Semtech Corporation
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$1.0000 | Transferred | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 50 Ω | 4.89 % | Qualified | O-LELF-R2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | HERMETIC SEALED PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||
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JAN1N4481
Microchip Technology Inc
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$8.4429 | No | Active | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||
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1N4481
Microsemi Corporation
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$9.0500 | No | Transferred | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | |||||||||||
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1N4481US
Microsemi Corporation
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$9.3240 | No | Transferred | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | Microsemi Corporation | |||||||||||
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1N4481
Microchip Technology Inc
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$9.8805 | No | Active | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||
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JAN1N4481
Microsemi Corporation
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$10.2638 | No | No | Transferred | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | DO-41 | ||||
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JANTX1N4481
Microsemi Corporation
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$10.7421 | No | Transferred | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | Microsemi Corporation | ||||||||
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JAN1N4481US
Microchip Technology Inc
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$11.1396 | No | Active | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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1N4481US
Microchip Technology Inc
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$11.8052 | No | Active | 5.5 mA | 1.5 W | 47 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LELF-R2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant |