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JAN1N3821CUR-1
Microchip Technology Inc
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$36.5790 | No | Active | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | ||||||||||||
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JANTX1N3821CUR-1
Microchip Technology Inc
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$41.9266 | No | Active | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | ||||||||||
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JANTXV1N3821CUR-1
Microchip Technology Inc
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$51.1159 | No | Active | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | ||||||||||
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JAN1N3821CUR-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB, 2 PIN | unknown | DO-213AB | 2 | EAR99 | 8541.10.00.50 | |||||||
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1N3821CUR-1E3
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 76 mA | 1.25 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 10 Ω | 2 % | Not Qualified | O-LELF-R2 | e3 | DO-213AB | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | DO-213AB | 2 | EAR99 | 8541.10.00.50 | ||||||
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MX1N3821CUR-1TR
Microsemi Corporation
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Check for Price | No | No | Transferred | 76 mA | 1.25 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH: 1500 | 2 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | DO-213AB | 2 | EAR99 | 8541.10.00.50 | |||||
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JANTXV1N3821CUR-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 2 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB, 2 PIN | unknown | DO-213AB | 2 | EAR99 | 8541.10.00.50 | |||||
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JAN1N3821CUR-1
Defense Logistics Agency
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Check for Price | Active | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LELF-R2 | MIL-19500/115K | DO-213AB | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | DO-213AB, 2 PIN | unknown | |||||||||||||||
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JAN1N3821CUR-1
VPT Components
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Check for Price | Active | 76 mA | 1 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 2 % | Qualified | O-LELF-R2 | MIL-19500 | DO-213AB | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | VPT COMPONENTS | MELF-2 | unknown | EAR99 | 8541.10.00.50 | 2019-09-27 | |||||||||||||
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MV1N3821CUR-1E3TR
Microsemi Corporation
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Check for Price | Yes | Yes | Transferred | 76 mA | 1.25 W | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | TR, 7 INCH: 1500 | 2 % | Not Qualified | O-LELF-R2 | e3 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | DO-213AB | 2 | EAR99 | 8541.10.00.50 |