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JAN1N973D-1
Microchip Technology Inc
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$6.5382 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||
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JAN1N973D-1/TR
Microchip Technology Inc
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$6.7025 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 1 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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JANTX1N973D-1
Microchip Technology Inc
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$6.7525 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||
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JANTX1N973D-1/TR
Microchip Technology Inc
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$6.9182 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 1 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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JAN1N973DUR-1
Microchip Technology Inc
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$14.6719 | No | Active | 3.8 mA | 500 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 1 % | Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||
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JANTXV1N973D-1
Microchip Technology Inc
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$15.2175 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||
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JANTXV1N973D-1/TR
Microchip Technology Inc
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$15.3818 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 1 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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JANTX1N973DUR-1
Microchip Technology Inc
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$24.4396 | No | Active | 3.8 mA | 500 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 1 % | Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||
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JANTXV1N973DUR-1
Microchip Technology Inc
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$24.9630 | No | Active | 3.8 mA | 500 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 1 % | Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||
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1N973DE3TR
Microsemi Corporation
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Check for Price | Yes | Obsolete | 3.8 mA | 417 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 58 Ω | 2 % | Not Qualified | O-LALF-W2 | e3 | DO-204AA | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROSEMI CORP | O-LALF-W2 | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 |