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JAN1N973B-1
Microchip Technology Inc
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$2.0618 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||
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JANTX1N973B-1
Microchip Technology Inc
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$2.1311 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||
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JAN1N973B-1
Microsemi Corporation
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$2.1368 | No | No | Transferred | 3.8 mA | 500 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETICALLY SEALED, GLASS PACKAGE-2 | not_compliant | DO-35 | 2 | EAR99 | 8541.10.00.50 | |||||||
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1N973B
Microchip Technology Inc
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$2.1468 | No | Active | 3.8 mA | 417 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | |||||||||||||||
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1N973B-1
Microchip Technology Inc
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$2.1468 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||
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JAN1N973B-1/TR
Microchip Technology Inc
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$2.2011 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 5 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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JANTX1N973B-1/TR
Microchip Technology Inc
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$2.2611 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 5 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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1N973B-1/TR
Microchip Technology Inc
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$2.3403 | No | Active | 3.8 mA | 500 nA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 58 Ω | 1 kΩ | 25 V | 30.36 mV/°C | 5 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||||
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JANTX1N973B-1
Microsemi Corporation
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$2.4235 | No | No | Transferred | 3.8 mA | 500 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETICALLY SEALED, GLASS PACKAGE-2 | not_compliant | DO-35 | 1 | EAR99 | 8541.10.00.50 | |||||||
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JANTX1N973B-1
MACOM
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$2.9774 | Transferred | 3.8 mA | 400 mW | 33 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 5 % | Qualified | O-LALF-W2 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | compliant | EAR99 | 8541.10.00.50 |