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JAN1N966C-1
Microchip Technology Inc
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$5.2234 | No | Active | 7.8 mA | 500 nA | 400 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 700 Ω | 12 V | 13.28 mV/°C | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||
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JAN1N966C-1/TR
Microchip Technology Inc
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$5.3891 | No | Active | 7.8 mA | 500 nA | 400 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 700 Ω | 12 V | 13.28 mV/°C | 2 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||
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JANTX1N966C-1
Microchip Technology Inc
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$5.9269 | No | Active | 7.8 mA | 500 nA | 400 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 700 Ω | 12 V | 13.28 mV/°C | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||
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JANTX1N966C-1/TR
Microchip Technology Inc
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$6.0990 | No | Active | 7.8 mA | 500 nA | 400 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 700 Ω | 12 V | 13.28 mV/°C | 2 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||
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JANTXV1N966C-1
Microchip Technology Inc
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$9.1835 | No | Active | 7.8 mA | 500 nA | 400 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 700 Ω | 12 V | 13.28 mV/°C | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||
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JANTXV1N966C-1/TR
Microchip Technology Inc
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$9.3349 | No | Active | 7.8 mA | 500 nA | 400 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 17 Ω | 700 Ω | 12 V | 13.28 mV/°C | 2 % | O-LALF-W2 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||
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JAN1N966CUR-1
Microchip Technology Inc
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$11.7410 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 2 % | Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||
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JANTX1N966CUR-1
Microchip Technology Inc
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$14.8483 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 2 % | Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||
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JANTXV1N966CUR-1
Microchip Technology Inc
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$19.9653 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 2 % | Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||
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JANTX1N966C
VPT Components
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Check for Price | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/117 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | VPT COMPONENTS | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 |