Parametric results for: 1N825A under Zener Diodes
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1N825A
American Power Devices Inc
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$1.8735 | Obsolete | 7.5 mA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 10 Ω | 0.124 mV/°C | 4.83 % | Not Qualified | O-LALF-W2 | e3 | DO-7 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | AMERICAN POWER DEVICES INC | DO-7 | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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1N825A
Microchip Technology Inc
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$4.2421 | No | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.124 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | ||||||||||||
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1N825A/TR
Microchip Technology Inc
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$4.4371 | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.124 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||||||
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1N825AE3
Microchip Technology Inc
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$4.4371 | Yes | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.124 mV/°C | 4.84 % | O-LALF-W2 | e3 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | Microchip | |||||||||||||||
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1N825A
Microsemi Corporation
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$4.4931 | No | No | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.124 mV/°C | 4.84 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS, DO-7, 2 PIN | 2 | not_compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||
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1N825A-1
Microchip Technology Inc
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$4.6485 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.124 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | ||||||||
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1N825A-1E3
Microchip Technology Inc
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$4.8371 | Yes | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.124 mV/°C | 5 % | O-LALF-W2 | e3 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | ||||||||
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1N825A-1E3
Microsemi Corporation
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$4.8563 | Yes | Yes | Transferred | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 10 Ω | 3 V | 0.124 mV/°C | 5 % | O-LALF-W2 | e3 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROSEMI CORP | DO-35 | DO-35, 2 PIN | 2 | compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||
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1N825A-1E3/TR
Microchip Technology Inc
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$5.0241 | Yes | Active | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.124 mV/°C | 4.84 % | O-LALF-W2 | e3 | DO-204AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | Microchip | |||||||||||||
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1N825AUR-1
Microsemi Corporation
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$6.0217 | No | No | Transferred | ZENER DIODE | e0 | TIN LEAD | MICROSEMI CORP | DO-213AA | 2 | unknown | EAR99 | 8541.10.00.50 |