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1 - 10 of 65 results
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1N821-1
Microsemi Corporation
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$2.8550 | No | No | Transferred | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | DO-35, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||
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1N821-1E3
Microchip Technology Inc
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$4.0387 | Yes | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | O-LALF-W2 | e3 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | Microchip | ||||||||
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JANTX1N821-1
Cobham Semiconductor Solutions
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$4.2146 | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.62 mV/°C | 4.84 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/159M | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | DO-35 | HERMETIC SEALED PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||
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1N821-1E3/TR
Microchip Technology Inc
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$4.2571 | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | O-LALF-W2 | e3 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | Microchip | ||||||||
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JANTX1N821-1
MACOM
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$4.3734 | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.62 mV/°C | 4.84 % | Qualified | O-XALF-W2 | e0 | MIL-19500/159M | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 | ||||||||||||||
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1N821-1
Microchip Technology Inc
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$5.0428 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||
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1N821-1/TR
Microchip Technology Inc
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$5.1941 | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||
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JANTX1N821-1
Microsemi Corporation
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$5.5401 | No | No | Transferred | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | DO-35, 2 PIN | 2 | unknown | EAR99 | 8541.10.00.50 | |||
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JANTXV1N821-1
MACOM
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$6.7008 | Transferred | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.62 mV/°C | 4.84 % | Qualified | O-XALF-W2 | e0 | MIL-19500/159M | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | HERMETIC SEALED PACKAGE-2 | compliant | EAR99 | 8541.10.00.50 | ||||||||||||||
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JAN1N821-1
Microchip Technology Inc
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$6.9596 | No | Active | 7.5 mA | 2 µA | 500 mW | 6.2 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 15 Ω | 3 V | 0.62 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant |