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1 - 10 of 383 results
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1N752A
SPC Multicomp
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$0.0391 | Active | 20 mA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY | 5 % | O-LALF-W2 | DO-35 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MULTICOMP PRO | GLASS PACAKGE-2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||
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1N752A-1
Microsemi Corporation
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$2.0202 | No | No | Transferred | 20 mA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||
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JAN1N752A-1
Microchip Technology Inc
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$2.1118 | No | Active | 20 mA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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1N752A-1
Microchip Technology Inc
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$2.2447 | No | Active | 20 mA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||
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1N752A
Microchip Technology Inc
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$2.2447 | No | Active | 20 mA | 1 µA | 417 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.68 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | ||||||||||
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1N752A/TR
Microchip Technology Inc
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$2.4211 | Active | 20 mA | 1 µA | 417 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.68 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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1N752A-1/TR
Microchip Technology Inc
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$2.4211 | Active | 20 mA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||||
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1N752A-1E3
Microchip Technology Inc
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$2.4374 | Yes | Active | 400 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e3 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Matte Tin (Sn) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||||||
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JANTX1N752A-1
Microchip Technology Inc
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$2.4503 | No | Active | 20 mA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JANTX1N752A-1/TR
Microchip Technology Inc
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$2.6074 | No | Active | 70 mA | 5 µA | 500 mW | 5.6 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 8 Ω | 2.5 V | 2.016 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant |