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JAN1N746D-1
Microchip Technology Inc
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$6.6925 | No | Active | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||||
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JAN1N746D-1/TR
Microchip Technology Inc
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$6.8496 | No | Active | 120 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | -2.31 mV/°C | 1 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||||||
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JANTX1N746D-1
Microchip Technology Inc
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$7.5444 | No | Active | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||||
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JAN1N746D-1
Microsemi Corporation
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$8.7866 | No | Transferred | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | ||||||||||
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JANTXV1N746D-1
Microchip Technology Inc
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$11.3160 | No | Active | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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JANTXV1N746D-1
Microsemi Corporation
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$13.9391 | No | No | Transferred | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | ||||||||
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JANTXV1N746D-1
Cobham Semiconductor Solutions
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Check for Price | Transferred | 20 mA | 480 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | DO-204AH | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | AEROFLEX/METELICS INC | DO-35 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | ||||||||||||||
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1N746D-1
VPT Components
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Check for Price | Active | 20 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 1 % | O-LALF-W2 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | VPT COMPONENTS | unknown | EAR99 | 8541.10.00.50 | |||||||||||||
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JANTX1N746D-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | |||||||||
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JAN1N746D-1
Cobham Semiconductor Solutions
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Check for Price | Transferred | 20 mA | 480 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | DO-204AH | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | AEROFLEX/METELICS INC | DO-35 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 |