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JAN1N6643U
Microchip Technology Inc
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$6.8288 | No | Active | 300 mA | 6 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | ||||||||||||||
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JAN1N6643US
Microchip Technology Inc
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$6.8822 | No | Active | 300 mA | 6 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | ||||||||||||||
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1N6643U
Microchip Technology Inc
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$7.6002 | No | Active | 300 mA | 1.2 V | 6 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | 2.5 A | 1 | Not Qualified | O-LELF-R2 | e0 | 200 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5D, 2 PIN | compliant | ||||||||||
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JANTX1N6643U
Microchip Technology Inc
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$7.7644 | No | Active | 300 mA | 1.2 V | 6 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 200 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | Microchip | |||||||
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1N6643US/TR
Microchip Technology Inc
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$7.7744 | Active | 300 mA | 6 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Not Qualified | O-LELF-R2 | e0 | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.70 | |||||||||||||
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1N6643US
Microchip Technology Inc
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$7.8300 | No | Active | 300 mA | 6 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5D, 2 PIN | compliant | Microchip | |||||||||||||||
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JANTX1N6643US
Microchip Technology Inc
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$8.6300 | No | Active | 300 mA | 1.2 V | 6 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | Microchip | ||||||||
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JANTXV1N6643U
Microchip Technology Inc
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$10.8204 | No | Active | 300 mA | 1.2 V | 6 ns | 500 nA | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 200 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | ||||||||
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JANTXV1N6643US
Microchip Technology Inc
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$11.6124 | No | Active | 300 mA | 1.2 V | 6 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SURFACEMOUNT PACKAGE-2 | compliant | |||||||||
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JAN1N6643US
Semtech Corporation
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$16.9600 | Transferred | 300 mA | 6 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 50 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | SURFACEMOUNT PACKAGE-2 | unknown | EAR99 | 8541.10.00.70 | 2 |