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JANTX1N6468
Microchip Technology Inc
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$11.0296 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 51.6 V | 1 | AVALANCHE | 500 W | Qualified | O-XALF-W2 | e0 | MIL-19500/551C | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||
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JAN1N6468
Microchip Technology Inc
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$13.8613 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 51.6 V | 1 | AVALANCHE | 500 W | Qualified | O-XALF-W2 | e0 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||||
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JAN1N6468US
Microchip Technology Inc
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$14.7133 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 51.6 V | 1 | AVALANCHE | 500 W | Qualified | O-XELF-R2 | e0 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | SURFACE MOUNT PACKAGE-2 | |||||||||||||||
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1N6468
Microchip Technology Inc
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$15.5681 | No | Active | 78.5 V | 2.5 W | 55 V | SILICON | 54 V | TRANS VOLTAGE SUPPRESSOR DIODE | BIDIRECTIONAL | SINGLE | NO | 51.6 V | 1 | AVALANCHE | TEMPERATURE COEFFICIENT IS DERIVED FROM MINIMUM BREAK-DOWN VOLTAGE | 500 W | Not Qualified | O-LALF-W2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | GLASS, E PACKAGE, 2 PIN | ||||||||||||
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JAN1N6468
Semtech Corporation
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$15.8665 | Transferred | 78.5 V | 2.5 W | 55 V | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 51.6 V | 1 | AVALANCHE | 500 W | Qualified | O-XALF-W2 | MIL-19500/551C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | unknown | EAR99 | 8541.10.00.50 | SEMTECH | ||||||||||||||
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1N6468
Semtech Corporation
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$16.6112 | No | Transferred | 78.5 V | 3 W | 55 V | SILICON | 54 V | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | NO | 51.6 V | 1 | AVALANCHE | HIGH RELIABILITY | 500 W | Not Qualified | O-LALF-W2 | e0 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | SEMTECH CORP | not_compliant | HERMETIC SEALED, GLASS PACKAGE-2 | EAR99 | 8541.10.00.50 | 2 | |||||||
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1N6468US
Microchip Technology Inc
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$16.7322 | No | Active | 78.5 V | 2.5 W | SILICON | 54 V | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 51.6 V | 1 | AVALANCHE | HIGH RELIABILITY, METALLURGICALLY BODED | 500 W | Not Qualified | O-LELF-R2 | e0 | 175 °C | -55 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETICALLY SEALED, GLASS, D-5B, MELF-2 | |||||||||||
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1N6468US/TR
Microchip Technology Inc
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$16.8894 | Active | 78.5 V | 2.5 W | SILICON | 54 V | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 51.6 V | 1 | AVALANCHE | HIGH RELIABILITY, METALLURGICALLY BODED | 500 W | Not Qualified | O-LELF-R2 | e0 | 175 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||
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1N6468US
Semtech Corporation
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$17.3450 | No | No | Transferred | 78.5 V | 3 W | SILICON | 54 V | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 51.6 V | 1 | AVALANCHE | HIGH RELIABILITY | Not Qualified | O-LELF-N2 | e0 | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | NO LEAD | END | SEMTECH CORP | unknown | HERMETIC SEALED, GLASS PACKAGE-2 | EAR99 | 8541.10.00.50 | 2 | |||||||||||
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JANTX1N6468US
Microchip Technology Inc
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$20.7495 | No | Active | 2.5 W | SILICON | TRANS VOLTAGE SUPPRESSOR DIODE | UNIDIRECTIONAL | SINGLE | YES | 51.6 V | 1 | AVALANCHE | 500 W | Qualified | O-XELF-R2 | e0 | MIL-19500/551C | 175 °C | -55 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | SURFACE MOUNT PACKAGE-2 |