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1N6329US
Microchip Technology Inc
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$15.0825 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 12 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, B, D-5D, 2 PIN | compliant | ||||||||||
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JAN1N6329US
Microchip Technology Inc
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$16.4187 | No | Active | 7.8 mA | 50 nA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 12 Ω | 600 Ω | 12 V | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||
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JANTX1N6329US
Microchip Technology Inc
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$18.6398 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-XELF-R2 | MIL-19500/533F | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||
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JANTX1N6329US/TR
Microchip Technology Inc
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$18.8041 | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-XELF-R2 | MIL-19500/533F | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||||
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JANTX1N6329US
Microsemi Corporation
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$21.0772 | No | Transferred | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-XELF-R2 | MIL-19500/533F | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||||
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JANTXV1N6329US
Microchip Technology Inc
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$22.9820 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-GELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||||||
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JANTXV1N6329US/TR
Microchip Technology Inc
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$23.1520 | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-GELF-R2 | e0 | MIL-19500 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||
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JANS1N6329US
Microsemi Corporation
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$122.3232 | No | Transferred | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-XELF-R2 | e0 | MIL-19500/533F | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | not_compliant | EAR99 | 8541.10.00.50 | |||||||||
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JANS1N6329US
Microchip Technology Inc
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$138.8531 | No | Active | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-XELF-R2 | e0 | MIL-19500/533F | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||
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JAN1N6329US
Cobham Semiconductor Solutions
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Check for Price | Transferred | 7.8 mA | 500 mW | 16 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-XELF-R2 | MIL-19500/533F | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | AEROFLEX/METELICS INC | unknown | EAR99 | 8541.10.00.50 |