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Parametric results for: 1N6309US under Zener Diodes

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Manufacturer Part Number: 1n6309us
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1N6309US
 Microsemi Corporation 		$13.8338 No No Transferred 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED, HIGH RELIABILITY 30 Ω 5 % Not Qualified O-LELF-R2 e0 150 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROSEMI CORP HERMETIC SEALED, GLASS, B, D-5D, 2 PIN 2 unknown EAR99 8541.10.00.50
1N6309US
 Microchip Technology Inc 		$15.2239 No Active 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER METALLURGICALLY BONDED, HIGH RELIABILITY 30 Ω 5 % Not Qualified O-LELF-R2 e0 150 °C ISOLATED 2 GLASS ROUND LONG FORM TIN LEAD WRAP AROUND END MICROCHIP TECHNOLOGY INC HERMETIC SEALED, GLASS, B, D-5D, 2 PIN compliant Microchip
JAN1N6309US
 Microchip Technology Inc 		$15.7481 No Active 20 mA 100 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 30 Ω 1.2 kΩ 1 V 5 % Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC MELF-2 compliant
JAN1N6309US
 Microsemi Corporation 		$17.4930 No Transferred 20 mA 100 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 30 Ω 1.2 kΩ 1 V 5 % Not Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP MELF-2 2 unknown EAR99 8541.10.00.50 Microsemi Corporation
JANTX1N6309US
 Microchip Technology Inc 		$21.5607 No Active 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER 5 % Qualified O-XELF-R2 e0 MIL-19500/533F 175 °C -65 °C ISOLATED 2 UNSPECIFIED ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC compliant
JANTXV1N6309US
 Microchip Technology Inc 		$22.2885 No Active 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 5 % Qualified O-GELF-R2 e0 MIL-19500 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC MELF-2 compliant
JANTX1N6309US
 Microsemi Corporation 		$24.2388 No Transferred 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER 5 % Not Qualified O-XELF-R2 e0 MIL-19500/533F 175 °C -65 °C ISOLATED 2 UNSPECIFIED ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP 2 unknown EAR99 8541.10.00.50 Microsemi Corporation
JANTXV1N6309US
 Microsemi Corporation 		$24.9474 No Transferred 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER 5 % Not Qualified O-XELF-R2 e0 MIL-19500/533F 175 °C -65 °C ISOLATED 2 UNSPECIFIED ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROSEMI CORP unknown EAR99 8541.10.00.50 Microsemi Corporation
JANS1N6309US
 Microchip Technology Inc 		$140.1783 No Active 20 mA 100 µA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER HIGH RELIABILITY, METALLURGICALLY BONDED 30 Ω 1.2 kΩ 1 V 5 % Qualified O-LELF-R2 e0 MIL-19500 175 °C -65 °C ISOLATED 2 GLASS ROUND LONG FORM Tin/Lead (Sn/Pb) WRAP AROUND END MICROCHIP TECHNOLOGY INC MELF-2 compliant
JAN1N6309US
 Defense Logistics Agency 		Check for Price Active 20 mA 500 mW 2.4 V SILICON ZENER DIODE UNIDIRECTIONAL SINGLE YES 1 ZENER 5 % Qualified O-XELF-R2 MIL-19500/533F ISOLATED 2 UNSPECIFIED ROUND LONG FORM WRAP AROUND END DEFENSE LOGISTICS AGENCY unknown
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