Parametric results for: 1N5939 under Zener Diodes
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1N5939A
Microsemi Corporation
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$3.4965 | No | No | Transferred | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||||
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1N5939BG
Microchip Technology Inc
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$3.5059 | No | Active | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, DO-41, 2 PIN | |||||||||||
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1N5939AG
Microchip Technology Inc
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$3.5059 | No | Active | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, DO-41, 2 PIN | |||||||||||
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1N5939BUR-1
Microchip Technology Inc
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$4.6671 | No | Active | 9.6 mA | 1.25 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 45 Ω | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, MELF-2 | |||||||||
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1N5939BUR-1/TR
Microchip Technology Inc
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$4.8228 | Active | 9.6 mA | 1.25 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 45 Ω | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | |||||||||
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1N5939BUR-1
Microsemi Corporation
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$5.1660 | No | No | Transferred | 9.6 mA | 1.25 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 45 Ω | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.50 | HERMETIC SEALED, GLASS, MELF-2 | DO-213AB | 2 | ||||
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1N5939C
Microsemi Corporation
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$6.9930 | No | No | Transferred | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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1N5939CG
Microchip Technology Inc
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$7.0138 | No | Active | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 2 % | Not Qualified | O-LALF-W2 | e0 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, DO-41, 2 PIN | |||||||||||
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1N5939D
Microsemi Corporation
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$8.5470 | No | No | Transferred | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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1N5939DG
Microchip Technology Inc
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$8.5651 | No | Active | 9.6 mA | 1.5 W | 39 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-LALF-W2 | e0 | DO-204AL | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | compliant | HERMETIC SEALED, GLASS, DO-41, 2 PIN |